Printed Wiring Board In-Hole Component Gap Design
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Solution Overview
Problem
Existing methods for manufacturing printed wiring boards with built-in electronic components, such as ceramic capacitors, face issues with damage due to direct pressure and thermal expansion mismatch, leading to reduced connection reliability and component quality.
Innovation Solution
A printed wiring board design featuring a core substrate with a penetrating hole and a gap between the electronic component and the conductive layer, using a resin filler with inorganic particles to reduce thermal stress and prevent direct pressure on the component, while maintaining connection reliability through strategically positioned via conductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electronic component is directly mounted on the core substrate with conductive layers, then the connection reliability is improved, but the component is damaged due to direct pressure and thermal expansion mismatch
Solution Approach 1:
The patent introduces a resin filler as an intermediary material between the electronic component and the core substrate. This resin filler acts as a mediator that absorbs thermal expansion differences and distributes mounting pressure, preventing direct contact between the component and the rigid substrate while maintaining electrical connection through via conductors.
Solution Approach 2:
The resin filler is applied beforehand to the core substrate before mounting the electronic component. This pre-application creates a cushioning layer that anticipates and prevents damage from thermal stress and pressure during subsequent mounting and operation, rather than addressing damage after it occurs.
2Object-affected harmful factors
If a gap is introduced between the electronic component and the conductive layer, then thermal stress is reduced, but the connection reliability may be compromised
Solution Approach 1:
The resin filler serves as an intermediary that bridges the gap between the electronic component and the core substrate. This mediator maintains the necessary separation for thermal stress reduction while simultaneously providing a pathway for electrical connection through integrated via conductors that extend through the resin filler to contact pads on the substrate.
Solution Approach 2:
The solution employs a composite structure combining the resin filler material with conductive elements (via conductors). This composite approach allows the resin to provide thermal stress isolation while the embedded conductors ensure reliable electrical connection, achieving both goals simultaneously through material composition rather than separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances connection reliability and prevents damage to electronic components by mitigating thermal stress and pressure, ensuring the components function as intended with improved durability and performance.
Implementation Method 1
using a resin filler with inorganic particles to reduce thermal stress
Data Source
AI summary
A printed wiring board includes a core substrate having a penetrating hole, a first conductive layer on a first surface of the substrate, a second conductive layer on a second surface of the substrate, a first electronic component having an electrode and accommodated in the hole such that the electrode faces the first surface, a first structure on the first surface and including a pad for mounting a second electronic component on the first structure and a via conductor connected to the electrode, and a second structure on the second surface. The electrode has an upper surface facing toward the first surface, the first layer has an upper surface facing away from the first surface, and the first component is positioned in the hole such that the upper surface of the electrode forms a gap with the upper surface of the first layer.