PCB Insulating Layer Adhesion via Alkali Treatment
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Solution Overview
Problem
The challenge is to enhance adhesion between the insulating layer containing an inorganic filler and the conductor layer in printed circuit boards without compromising the thermal expansion properties, as existing methods often result in poor adhesion due to the presence of inorganic fillers.
Innovation Solution
An alkali treatment step is introduced where the insulating layer is brought into contact with an aqueous alkali solution, reducing the amount of inorganic filler on the surface and utilizing the peeled-off filler as an anchor for the conductor layer, combined with a resin composition containing thermosetting resins like maleimide and alkenyl-substituted nadimide compounds to improve adhesion and thermal properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If an inorganic filler is contained in the resin composition to reduce thermal expansion, then the warpage of semiconductor package is reduced, but the adhesion between the insulating layer and the conductor layer deteriorates
Solution Approach 1:
The insulating layer surface is subjected to alkali treatment before forming the conductor layer. This preliminary action removes the inorganic filler from the surface while preserving it in the bulk, creating a surface that promotes adhesion without compromising the thermal expansion properties of the overall insulating layer
Solution Approach 2:
The inorganic filler is selectively removed from the surface of the insulating layer through alkali treatment. This extraction eliminates the adhesion barrier at the surface while maintaining the filler's presence in the bulk to control thermal expansion
2Strength
If the surface of the insulating layer is treated to improve adhesion, then the adhesion between insulating layer and conductor layer is enhanced, but the thermal expansion properties may be compromised
Solution Approach 1:
The insulating layer exhibits different compositions at different locations: the bulk contains inorganic filler for thermal expansion control, while the surface has the filler removed to provide adhesion promotion. This local differentiation resolves the contradiction between thermal stability and adhesion strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively enhances the adhesion between the insulating and conductor layers while maintaining low thermal expansion and improved thermal resistance, suppressing warpage in semiconductor packages.
Implementation Method 1
an alkali treatment step of bringing a surface of an insulating layer into contact with an aqueous alkali solution
Data Source
AI summary
It is intended to provide a method for producing a printed circuit board capable of enhancing the adhesion between the inorganic filler-containing insulating layer and the conductor layer of a printed circuit board. The method for producing a printed circuit board of the present invention is a method for producing a printed circuit board, having an alkali treatment step of bringing a surface of an insulating layer for a printed circuit board into contact with an aqueous alkali solution, and a conductor layer forming step of forming a conductor layer on at least a part of the surface of the insulating layer that has undergone the alkali treatment step, wherein the insulating layer contains a resin composition containing a thermosetting resin, a silane compound having a (meth)acrylic skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.