PCB Insulation Structure With Laterally Shifted Screws
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Solution Overview
Problem
Conventional printed circuit board insulation structures that use metal screws and spacers result in increased device size due to large insulation distances and wiring pattern prohibition areas, especially at high operation voltages, and commercially available insulation supports further exacerbate this issue.
Innovation Solution
A printed circuit board insulation structure that employs a resin insulation plate with first and second screws arranged laterally shifted within helical inserts, ensuring the screws' electric potentials differ from the metal casing, minimizing insulation distance and allowing for reduced device size while maintaining effective insulation and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal spacer is pressed into the metal casing and a metal screw is used to fix the printed circuit board, then the insulation distance and wiring pattern prohibition area increase, but the device size increases
Solution Approach 1:
The patent transitions from a single-screw vertical fixation to a dual-screw lateral-shifted configuration embedded in the insulation plate. This dimensional redistribution allows the screws to be positioned at different lateral locations, optimizing both insulation distance and space utilization, thereby reducing the overall device footprint while maintaining required insulation clearance
Solution Approach 2:
The insulation plate serves as an intermediary component between the metal casing and the printed circuit board. It embeds the screws and provides electrical insulation, eliminating the need for separate metal spacers and washers. This mediator approach consolidates multiple functions (insulation, screw embedding, structural support) into one component, reducing device size
2Reliability
If a commercially available insulation support is used to fix the printed circuit board to the metal casing, then insulation is achieved, but the device size increases due to the large support structure
Solution Approach 1:
The patent merges the insulation support function with the screw fixation structure into a single integrated insulation plate. The screws are embedded directly into the insulation plate, eliminating the need for separate insulation supports. This consolidation reduces the number of components and overall device size while maintaining effective insulation between the metal casing and printed circuit board
3Reliability
If the wiring pattern prohibition area is increased to ensure insulation distance at high operation voltages, then insulation reliability improves, but the wiring pattern area and component mounting area are reduced
Solution Approach 1:
The patent employs asymmetric positioning of the two screws within the insulation plate, where the screws are located at different lateral positions rather than symmetrically arranged. This asymmetric configuration optimizes the distribution of insulation clearance requirements, allowing the wiring pattern area to be maximized while still maintaining adequate insulation distances from both screw locations
Data Source
AI summary
A printed circuit board is fixed to a resin insulation plate by using a first metal screw, and a metal casing is fixed to the resin insulation plate by using a second metal screw. The cuboid insulation plate is arranged to match the shapes of the long sides of the printed circuit board and the metal casing necessary for screw fixation. The first and second metal screws are attached to the resin insulation plate with a lateral shift. This makes it possible to reduce the insulation distance around the first metal screw on the printed circuit board and to increase the wiring pattern area and the component mounting space, realizing a reduction in the size of an electronic device.