PCB Integrated Coil Heat Dissipation via Thermal Inter-layer Connections
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Solution Overview
Problem
In magnetic devices used in DC-DC converters, high current flowing through coil patterns generates significant heat, leading to increased board temperatures, which can affect device performance and potentially damage other electronic components, while widening the coil patterns for better heat dissipation increases the device size, contradicting the need for a compact design.
Innovation Solution
A printed circuit board with integrated coil features coil patterns on multiple layers, with heat-dissipation patterns on outer surfaces and thermal inter-layer connections to efficiently transfer heat away from the coil patterns without enlarging the device, using conductor-based heat-dissipation patterns and inter-layer connections to manage heat without increasing the board's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the coil pattern is widened in the plate face direction to improve heat dissipation, then heat dissipation performance is improved, but the size of the board and magnetic device becomes larger
Solution Approach 1:
The patent extends heat dissipation from the traditional two-dimensional plate face direction to the three-dimensional thickness direction by forming heat-dissipation pattern portions that protrude downward from the upward board, enabling heat to be dissipated through both the upper and lower surfaces of the board simultaneously
Solution Approach 2:
The coil pattern is divided into a first coil pattern portion on the upward board and a second coil pattern portion on the downward board, with heat-dissipation pattern portions specifically configured on the upward board to protrude downward, creating separate functional zones for electrical conduction and heat dissipation
2Power
If high current flows in the coil pattern to increase power output, then power conversion capability is improved, but heat generation increases causing board temperature to rise
Solution Approach 1:
The patent converts the harmful effect of heat generation into a beneficial heat dissipation mechanism by forming heat-dissipation pattern portions that protrude downward and make direct contact with outside air, transforming the thermal energy that would otherwise damage components into an可控 heat dissipation pathway
Solution Approach 2:
Specific regions of the board are configured with heat-dissipation pattern portions having different geometries and positions, with each portion tailored to dissipate heat from corresponding coil pattern sections, creating localized heat management zones that maintain uniform temperature distribution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for effective heat dissipation from the coil patterns, preventing temperature rises that could impact device performance, while maintaining a compact size by separating heat-dissipation and electrical paths, thus ensuring reliable operation and minimizing size increments.
Implementation Method 1
thermal inter-layer connection means formed of a conductor for connecting the coil pattern provided in the another layer and the heat-dissipation pattern provided in the one outer surface layer
Data Source
AI summary
A printed circuit board with integrated coil includes: a plurality of layers; and coil patterns which are formed of a conductor and which are provided in at least one outer surface layer and another layer of the plurality of layers. A heat-dissipation pattern formed of a conductor is provided on at least the one outer surface layer so as to correspond to the coil pattern provided in the another layer. The coil pattern provided in the one outer surface layer and the heat-dissipation pattern provided in the one outer surface layer are separated from each other. A thermal inter-layer connector formed of a conductor is provided to connect the coil pattern provided in the another layer and the heat-dissipation pattern provided in the one outer surface layer which correspond to each other.