PCB Integrated Liquid Cooling Circuit
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Solution Overview
Problem
Conventional electronic assembly liquid cooling systems are complex and costly to fabricate, and they often experience reliability issues with maintaining liquid-tight interfaces.
Innovation Solution
A cooled electronic assembly comprising a printed circuit board, a flip chip with a coolant channel, a liquid pump, a molding material, and a cover with a coolant channel connected to a heat exchanger, forming a closed coolant circuit, where the liquid pump is operatively connected to the circuit, and a method involving electrical connections, molding, and attaching a cover to create a simplified and reliable cooling system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional liquid cooling systems are used with separate heat exchangers and plumbing, then heat removal capability is achieved, but system complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the coolant distribution function directly into the printed circuit board by forming coolant channels within the PCB structure itself, eliminating the need for separate external plumbing and heat exchangers. This integration reduces the number of components and simplifies the overall cooling system architecture while maintaining effective heat removal from electronic components.
Solution Approach 2:
The printed circuit board is given multiple functions: it serves as both the electrical connection substrate and the coolant distribution manifold. The PCB's structural layers are utilized to form coolant channels, allowing the same component to perform both electrical and thermal management functions, thereby reducing system complexity.
2Temperature
If conventional liquid cooling systems with multiple components are assembled, then cooling function is provided, but assembly complexity and cost increase
Solution Approach 1:
The cooling channels are formed as integral parts of the PCB during the PCB manufacturing process itself, rather than requiring separate assembly steps. This integration means the cooling function is built-in from the start, eliminating the need to assemble separate cooling components and reducing manufacturing complexity.
3Temperature
If conventional cooling systems with multiple interfaces are used, then heat transfer is achieved, but liquid-tight interface reliability deteriorates
Solution Approach 1:
By integrating the coolant channels directly into the PCB structure, the patent eliminates multiple separate liquid-tight interfaces that would exist between separate components. The continuous channels formed within the PCB layers reduce the number of potential leak points and improve the reliability of the liquid cooling system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a cooled electronic assembly that is less costly and less complicated to assemble, with more reliable liquid-tight interfaces compared to conventional systems, providing an efficient and enclosed re-circulating liquid cooling system.
Implementation Method 1
a liquid pump operatively connected to the closed coolant circuit
Implementation Method 2
a heat exchanger, and a cover. The cover has a second coolant channel fluidly connected to the heat exchanger
Implementation Method 3
The molding material is molded to the flip chip, to the liquid pump, and to the printed circuit board
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
A cooled electronic assembly includes an integrated-circuit device carrier (such as a printed circuit board), a device (such as a flip chip), a liquid pump, a molding material, a heat exchanger, and a cover. The device and the liquid pump are electrically connected to the integrated-circuit device carrier. The molding material is molded to the device, to the liquid pump, and to the integrated-circuit device carrier. The cover has a coolant channel fluidly connected to the heat exchanger, wherein the cover is attached to the molding material. The coolant channel and the heat exchanger together at least partially define a closed coolant circuit. The liquid pump is operatively connected to the closed coolant circuit. A method for cooling a printed circuit board includes placing a liquid coolant in the closed coolant circuit and electrically activating the liquid pump through the printed circuit board.