PCB Integrated Multi-Pass Cooling for Power Electronics Thermal Management
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Solution Overview
Problem
Conventional heat sinks fail to adequately manage the increased heat flux in power electronics due to additional thermal resistance from bonding layers and fixed size limitations, making them ineffective for high-power applications.
Innovation Solution
The integration of a printed circuit board assembly with internal fluid channels and semiconductor material-based heat transfer layers, including a fluid inlet layer, target heat transfer layer, second-pass heat transfer layer, and power device layer, which eliminates the need for extraneous bonding layers and reduces thermal resistance by using a multi-pass jet impingement cooling system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat sinks are used to remove heat from power electronics devices, then heat removal capability is provided, but thermal resistance increases due to additional bonding layers and thermal interface materials
Solution Approach 1:
The patent merges the heat transfer function directly into the PCB substrate by integrating fluid channels and heat transfer layers within the substrate structure itself. This eliminates the need for separate bonding layers and thermal interface materials between the power electronics device and heat sink, thereby reducing thermal resistance while maintaining effective heat removal capability
Solution Approach 2:
The patent introduces an intermediary cooling fluid system with internal channels embedded in the PCB substrate. This fluid-mediated heat transfer approach provides a direct thermal pathway from the power electronics device through the substrate to the heat sink, eliminating the need for additional bonding layers and reducing overall thermal resistance
2Temperature
If conventional heat sinks are used for heat removal, then cooling function is provided, but adaptability is limited due to fixed size configuration
Solution Approach 1:
The patent enables dynamic adaptability by allowing the PCB substrate with integrated cooling channels to be configured in different sizes and power capacities. The modular design permits the assembly to be scaled and adjusted for various power requirements, eliminating the fixed-size limitation of conventional heat sinks while maintaining effective heat removal through the integrated fluid cooling system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces thermal resistance and enhances heat management in power electronics devices, allowing for flexible power capacity and size adjustments while maintaining efficient coolant flow and heat transfer.
Implementation Method 1
Cooling fluid may be used to receive heat generated by the heat generating device by convective thermal transfer
Implementation Method 2
a jet of cooling fluid may be directed such that it impinges a surface of the heat generating device
Implementation Method 3
The fluid inlet layer, the fluid outlet layer, the target heat transfer layer, the second-pass heat transfer layer, and the power device layer comprise a semiconductor material
Data Source
AI summary
A power electronics card assembly includes a printed circuit board assembly including a printed circuit board substrate, a power electronics device opening, a fluid inlet channel extending from a perimeter of the printed circuit board assembly to the power electronics device opening, a fluid outlet channel within the printed circuit board substrate extending from the perimeter of the printed circuit board assembly to the power electronics device opening, and electrically conductive power connections. A power electronics device is positioned within the power electronics device opening and includes a fluid inlet layer fluidly coupled to the fluid inlet channel, a fluid outlet layer fluidly coupled to the fluid outlet channel, a target heat transfer layer fluidly coupled to the fluid inlet layer, a second pass-heat transfer layer and a power device layer. The second-pass heat transfer layer is fluidly coupled to the target heat transfer layer and the fluid outlet layer.