PCB Integrated Switching Element with Vertical Busbars

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Solution Overview

Problem

Conventional power converters for electric vehicles face challenges with parasitic inductances and space requirements due to the arrangement of intermediate circuit capacitors on printed circuit boards, which lead to voltage peaks and inefficiencies.

Innovation Solution

Integrating intermediate circuit capacitors vertically or horizontally into the layer sequence of printed circuit boards, with busbars running substantially one above the other, to minimize inductances and reduce space requirements while increasing contact connection areas.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If intermediate circuit capacitors are mounted horizontally on the surface of the printed circuit board as population components, then the capacitors can be easily installed and soldered, but the inductances are increased and voltage peaks occur due to parasitic inductances

Engineering Contradiction:

Improveease of installation and solderingVSAvoidparasitic inductances and voltage peaks

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent transitions the capacitor mounting from horizontal (surface-mounted) to vertical (through-hole) orientation, changing the spatial dimension of connection. The capacitor axis extends substantially vertically to the areal extent of the printed circuit board element, with connection areas on opposite sides connected to busbars running one above the other in the layer sequence, thereby reducing parasitic inductance paths.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Instead of mounting capacitors horizontally on the surface with connections extending laterally, the patent inverts the approach by mounting capacitors vertically through the board, with connections extending vertically through the layer sequence. This inversion of the mounting orientation fundamentally changes the current path geometry and reduces inductance.

Inventive Principle:

Principle #13The other way round (Inversion)

2Device complexity

If conventional horizontal mounting of capacitors is used, then the layout is simple, but the space requirement per component is large and contact connection area is limited

Engineering Contradiction:

Improvelayout simplicityVSAvoidspace requirement and contact connection area

Core Design Contradiction:

Device complexityVSArea of stationary object

Solution Approach 1:

The vertical mounting orientation utilizes the third dimension (through the board thickness) rather than only the two-dimensional surface, effectively reducing the footprint area occupied by each capacitor while increasing the contact connection area through the vertical busbar arrangement in the layer sequence.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Object-affected harmful factors

If busbars are arranged one above the other in the layer sequence with capacitors inserted vertically, then inductances are reduced and voltage peaks are minimized, but the manufacturing process becomes more complex

Engineering Contradiction:

Improveinductances and voltage peaksVSAvoidmanufacturing process complexity

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent segments the manufacturing process into distinct stages: providing the printed circuit board element with recesses, inserting capacitors into these recesses, forming conductive connections through the layers, and creating the busbar structure. This segmentation allows each step to be optimized independently, managing overall manufacturing complexity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The capacitors are inserted into recesses in the printed circuit board element before the final lamination and conductive layer formation. This preliminary positioning ensures proper alignment and reduces the complexity of subsequent connection formation, as the capacitor locations are pre-established.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS10462905B2Printed circuit board element with integrated electronic switching element, power converter and method for producing a printed circuit board element

Publication Date: 2019.10.29 SCHWEIZER ELECTRONIC AG(DE)

AI summary

A printed circuit board element (LP) having at least one electronic switching element (12.1, 12.2, 12.3) integrated in the printed circuit board element (LP), which switching element comprises two semiconductor switches (14, 16) introduced into a layer sequence of the printed circuit board element (LP) and at least two busbars (20, 22, 24) formed to contact the semiconductor switches (14, 16), wherein the busbars (20, 22, 24) run substantially above one another in the layer sequence of the printed circuit board element (LP) and at least one intermediate circuit capacitor (C; C1, C2, C3, C4) arranged between the two busbars (20, 22) is introduced into the layer sequence of the printed circuit board element (LP).