Connectorless PCB Interconnect for Array Antenna
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Solution Overview
Problem
Conventional antenna array systems with connector-based interfaces are bulky, heavy, complex, and costly due to the use of edge-mounted cards and egg crate assemblies, which limit their bandwidth and increase manufacturing costs, especially in ultra-wide band applications.
Innovation Solution
A circuit board interconnect system with connectorless interconnects using high-aspect-ratio vias and printed circuit board technology to connect multiple layers, reducing the need for edge-mounted cards and providing isolation between the antenna array and ground plane, thereby decreasing size, weight, and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If connector-based interfaces and edge-mounted cards are used to connect antenna array to ground plane, then electrical connection is achieved, but size and weight increase significantly
Solution Approach 1:
The patent removes connectors and edge-mounted cards from the system by implementing a connectorless design where antenna elements are directly mounted on the circuit board. This extraction of unnecessary components directly reduces system size and weight while eliminating the complexity of mechanical interconnect structures.
Solution Approach 2:
The patent merges the antenna element mounting function with the circuit board structure itself. By integrating antenna elements directly onto the circuit board without separate mounting structures or connectors, the system achieves electrical connection and mechanical support through a unified structure, reducing overall size and complexity.
2Ease of manufacture
If connector-based interfaces are used for interconnection, then electrical connection is established, but manufacturing cost increases
Solution Approach 1:
The patent eliminates connectors and complex interconnect assemblies from the manufacturing process. By using a connectorless design where antenna elements are directly mounted and electrically connected to the circuit board, the system reduces the number of components that need to be procured, managed, and assembled, thereby lowering manufacturing costs.
Solution Approach 2:
The circuit board structure provides both mechanical support and electrical connection functions inherently, without requiring additional connector components. This self-service approach where the base structure performs multiple functions reduces the bill of materials and simplifies the manufacturing process.
3Weight of stationary object
If edge-mounted cards and egg crate assemblies are used, then structural support is provided, but system weight increases
Solution Approach 1:
The patent removes heavy structural components such as edge-mounted cards and egg crate assemblies by utilizing the circuit board itself as the primary structural support. This extraction of redundant structural elements significantly reduces system weight while maintaining necessary mechanical support through the integrated circuit board design.
4Adaptability or versatility
If conventional interconnect structures are used, then electrical connection is achieved, but bandwidth is limited
Solution Approach 1:
The patent removes conventional interconnect structures that limit bandwidth by implementing direct electrical connections between antenna elements and the circuit board. This extraction of bandwidth-limiting components enables ultra-wideband operation while reducing the complexity of the interconnection system.
Data Source
AI summary
An antenna system includes a first printed circuit board having an array of printed circuit board antenna elements, a second circuit board having a signal distribution network for the antenna elements, and at least one first interconnect structure coupled between a bottom surface of the first printed circuit board and a top surface of the second circuit board. The first interconnect structure can include first vias having an aspect ratio of greater than 10 to 1. The vias electrically connect to respective first contacts on the bottom surface of the first circuit board and to respective second contacts on the top surface of the second circuit board.