PCB Interconnect Assembly via Lamination and Electroplating
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Solution Overview
Problem
Current methods for connecting printed circuit boards (PCBs) lack a repeatable and efficient process that ensures reliable and continuous conductive interconnects, which is critical for maintaining system integrity and preventing catastrophic failures.
Innovation Solution
A method involving the alignment and lamination of PCBs with an adhesive component, followed by the deposition of a copper seed layer, electroplating, and the application of an insulator layer to create a reliable and continuous conductive interconnect without the need for traditional connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional connectors are used to connect PCBs, then electrical connection is achieved, but the process is complex and reliability is compromised
Solution Approach 1:
The patent merges the electrical connection function directly into the PCB structure by creating conductive interconnects that extend through the PCB substrate and bond to corresponding traces on mating PCBs. This eliminates the need for separate connector components, reducing overall system complexity while improving connection reliability through direct structural integration.
Solution Approach 2:
The patent extracts the connector function from separate components and integrates it directly into the PCB fabrication process. By removing the need for discrete connector parts and focusing on the PCB-to-PCB trace bonding interface, the solution simplifies the overall system architecture while maintaining reliable electrical connections.
2Productivity
If PCBs are connected using traditional methods, then electrical interconnect is established, but manufacturing process is inefficient and repeatable
Solution Approach 1:
The patent applies preliminary action by pre-forming conductive traces and interconnect structures during the PCB fabrication process itself, rather than adding connection features later. Alignment marks and bonding preparation are completed during manufacturing, enabling efficient and repeatable assembly operations when PCBs need to be mated together.
Solution Approach 2:
The patent replaces complex mechanical connector systems with a direct PCB-to-PCB bonding process that utilizes trace-to-trace electrical connections. This substitution of mechanical interlocking with direct structural bonding simplifies manufacturing and improves process repeatability by eliminating the need for precise mechanical fit-and-finish operations.
3Reliability
If conductive interconnects are created without proper bonding process, then electrical connection is achieved, but system integrity is compromised
Solution Approach 1:
The patent introduces an intermediary bonding process that facilitates reliable connection between PCB traces. By using controlled bonding methods (such as conductive adhesive bonding or trace welding) as an intermediary step, the system achieves strong electrical and mechanical bonds that maintain system integrity without requiring overly complex assembly procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides a robust and efficient method for bonding PCBs with continuous conductive interconnects, enhancing reliability and reducing the risk of system failures.
Implementation Method 1
aligning and stacking a plurality of printed circuit boards with at least one adhesive component, laminating the printed circuit boards and the adhesive component
Implementation Method 2
depositing a copper seed layer
Implementation Method 3
electroplating a copper layer
Data Source
AI summary
The invention provides a method of fabricating an interconnect comprising aligning and stacking a plurality of printed circuit boards with at least one adhesive component, laminating the printed circuit boards and the adhesive component, preparing bonded pair holes, depositing a copper seed layer, forming a copper plate image, electroplating a copper layer, removing a plate resist and depositing an insulator layer.