PCB Interlayer Conductor Layout Without Straight-Line Through Holes
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Solution Overview
Problem
Existing printed circuit boards face limitations in circuit design flexibility and are prone to connection failures due to the requirement of through holes in a straight line in the plate thickness direction.
Innovation Solution
The design incorporates a middle interlayer circuit extending in the plane direction, with upper and lower surface side interlayer circuits extending in the plate thickness direction, and insulating layers, allowing for a connection surface-less integral conductor configuration that eliminates the need for straight-line through holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through holes are provided in a straight line in the plate thickness direction to connect upper and lower surface circuits, then reliable electrical connection is achieved, but the degree of freedom in circuit design is constrained
Solution Approach 1:
The patent transitions from traditional through-hole connections (vertical dimension only) to a combination of partial through-holes and interlayer circuits that extend horizontally across insulating layers. This multi-dimensional approach allows circuits to connect upper and lower surfaces without requiring straight-line alignment, thereby improving design freedom while maintaining connection reliability.
2Reliability
If through holes are used to connect upper and lower surface circuits, then electrical connection is established, but the plating process requires satisfactory contact which may lead to initial disconnection or thermal expansion issues
Solution Approach 1:
The patent merges the functions of through-holes and interlayer circuits into an integrated connection structure. The interlayer circuits extend from partial through-holes across insulating layers to connect different surface circuits, combining the advantages of both approaches while eliminating the need for complete through-hole plating, thus reducing plating process complexity and improving connection reliability.
3Ease of manufacture
If straight-line through holes are required for connecting circuits, then manufacturing process is simplified, but circuit design flexibility is limited
Solution Approach 1:
The patent segments the traditional through-hole connection into multiple components: partial through-holes that penetrate only certain insulating layers and interlayer circuits that extend horizontally to connect different surfaces. This segmentation allows each component to be manufactured using simplified processes while enabling flexible circuit layouts that are not constrained by straight-line requirements.
Data Source
AI summary
[Object] Provided is a printed circuit board ensuring a degree of freedom in circuit design and unlikely to cause a circuit connection failure.[Solving Means] A middle interlayer circuit 11, an upper surface side interlayer circuit 12, and a lower surface side interlayer circuit 13 are formed from a connection surface-less integral conductor. In addition, a connection surface 33 between the upper surface side interlayer circuit 12 and an upper surface side surface layer circuit 14 and a connection surface 34 between the lower surface side interlayer circuit 13 and a lower surface side surface layer circuit 15 lack a connection surface in a plate thickness direction, and thus a satisfactory connection state is achieved. Accordingly, a first circuit 10 is unlikely to cause a connection failure. In addition, the upper surface side interlayer circuit 12 and the lower surface side interlayer circuit 13 can be disposed at misaligned positions in the plane direction of the printed circuit board, and thus the degree of freedom in circuit design increases. Plane circuits 24 and 16 not connected to the first circuit can be disposed with insulating layers 31 and 32 sandwiched below the upper surface side interlayer circuit 12 or above the lower surface side interlayer circuit 13.