PCB Interposer Layout for Direct OSFP Transceiver Links
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Solution Overview
Problem
Existing technologies have overlooked the potential for direct electrical connections between OSFP transceivers, limiting the development of new applications and requiring inefficient RF cables for signal transmission.
Innovation Solution
A PCB interposer platform with adjustable length connections is introduced, utilizing length-adjustable PCB traces and vias to establish direct, uniform, and shortest electrical connections between two OSFP transceivers, eliminating the need for RF cables.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If RF cables are used for signal transmission between OSFP transceivers, then signal transmission is achieved, but space usage increases and connection uniformity is lost
Solution Approach 1:
A PCB interposer board is introduced as an intermediary component between two OSFP transceivers. The interposer board provides controlled impedance traces and vias that serve as a standardized transmission medium, replacing the need for external RF cables while maintaining signal integrity through precise electromagnetic field control.
Solution Approach 2:
The patent replaces the mechanical connection system (RF cables with connectors) with an integrated PCB trace system. The electrical connections are achieved through controlled impedance traces and vias etched into the PCB substrate, eliminating the need for separate mechanical cable assemblies and achieving more compact, uniform connections.
2Reliability
If non-uniform length connections are used between transceivers, then manufacturing is simpler, but signal transmission performance deteriorates
Solution Approach 1:
The patent employs adjustable length PCB traces with selectable connection paths (Type I, Type II, Type III configurations) that allow precise control of trace lengths. By changing the routing parameters and trace geometry on the PCB interposer, uniform electrical connection lengths are achieved for all high-speed signal pairs, ensuring consistent signal transmission performance across all channels.
3Area of stationary object
If direct electrical connections are implemented between transceivers, then space is minimized and uniformity is achieved, but manufacturing complexity increases
Solution Approach 1:
The PCB interposer board serves multiple functions simultaneously: it provides mechanical support for both OSFP transceivers, establishes electrical connections through controlled impedance traces, provides signal routing with adjustable lengths, and ensures proper signal termination. This multi-functionality consolidates what would otherwise require separate components into a single integrated platform.
Solution Approach 2:
The patent utilizes the third dimension (vertical via holes) in addition to planar trace routing to achieve direct electrical connections between opposite sides of the PCB interposer. Through-holes and vias provide vertical signal paths that reduce the number of lateral trace segments needed, simplifying the overall manufacturing process while achieving compact, uniform connections.
Data Source
AI summary
Two OSFP transceivers' connectors' footprints are placed on the opposite sides of a PCB board. The two footprints are aligned in a special way and the connections among the high speed signals' pads of the two footprints are specially defined. Based on that, the high speed signals' pads of the two footprints are connected through PCB traces and vias. Two OSFP electrical connectors are soldered onto the two footprints. So the electrical high-speed signals coming from two OSFP transceivers are directly connected in the shortest way when the two transceivers are respectively plugged into the two OSFP connectors.