PCB Laminate Interposer Layout for High-Frequency Signal Shielding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In 5G mobile terminals, the PCB laminated structure experiences interference due to parasitic resonance from electronic devices, leading to signal distortion and reduced communication quality, especially in high-frequency bands.
Innovation Solution
A PCB laminated structure with an interposer assembly that includes signal vias and ground vias, where the signal vias and ground vias are alternately arranged at regular intervals, and a metal coating layer is formed on the housing to shield signals, minimizing interference and resonance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an interposer assembly is disposed between laminated circuit boards to transmit electronic signals, then signal transmission between substrates is enabled, but parasitic resonance occurs in high frequency bands due to electronic devices located between the laminated circuit boards, causing signal distortion and deteriorating communication quality
Solution Approach 1:
The patent introduces an interposer assembly as an intermediary component between the first and second substrates. This interposer assembly includes signal vias for transmitting signals and ground vias for providing reference potential and shielding. The ground vias act as a mediator to reduce the impact of parasitic resonance from electronic devices located between the substrates, thereby improving signal transmission quality in high frequency bands.
Solution Approach 2:
The patent applies local quality by selectively positioning ground vias at specific locations relative to signal vias. The ground vias are spaced at optimized distances from the signal vias to effectively shield against parasitic resonance without interfering with signal transmission. This localized arrangement of ground vias provides targeted protection against interference in critical areas while maintaining overall signal integrity.
2Reliability
If ground vias are added to the interposer assembly to prevent parasitic resonance, then signal distortion is reduced, but the device complexity increases
Solution Approach 1:
The interposer assembly is segmented into distinct functional components: signal vias for signal transmission and ground vias for shielding and reference potential. This segmentation allows each via type to be optimized independently for its specific function, reducing overall complexity while maintaining effectiveness. The ground vias are further segmented and positioned at specific locations rather than uniformly distributed, simplifying the structure while achieving the desired shielding effect.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively transmits high-frequency data signals and digital signals while preventing signal distortion and intensity reduction in specific frequency bands, enhancing communication quality.
Implementation Method 1
a signal via connected to the first and second substrates, respectively, to transmit electromagnetic signals between the first substrate and the second substrate
Implementation Method 2
a metal coating layer for shielding signals is formed on a side surface of the housing
Data Source
Figure 1A
Figure 1B~1C
Figure 2
AI summary
The present disclosure relates to a PCB laminated structure, including a first substrate; a second substrate disposed to overlap with the first substrate on the top and bottom; and an interposer assembly provided between the first substrate and the second substrate to allow electromagnetic connection between the first and second substrates, wherein the interposer assembly includes a housing configured to form a closed region along a top surface circumference of the first substrate and a bottom surface circumference of the second substrate to support the first and second substrates; a signal via connected to the first and second substrates, respectively, to transmit electromagnetic signals between the first substrate and the second substrate; and a ground via connected to the housing to serve as a ground, and spaced a set distance from the signal via at one side of the signal via.