PCB Sheet Inversion for Connector Interference Avoidance
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Solution Overview
Problem
The existing methods for manufacturing printed circuit boards from a single circuit board sheet result in wasted resources and reduced efficiency due to the interference of surface-mounted connectors during the bending process, which limits the number of boards that can be obtained and requires additional cutting steps.
Innovation Solution
A method involving printing solder paste on both surfaces of a circuit board sheet, mounting connectors strategically to avoid interference, and bending along separation lines to separate the boards, allowing for efficient production of multiple printed circuit boards with the same connector layout.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If connectors are disposed near the other side of the printed circuit board (in the holding region), then the usable area of the circuit board sheet is reduced and resources are wasted, but if connectors are disposed toward the separation lines, the connectors on opposite sides interfere with each other during bending
Solution Approach 1:
The patent applies reversible imposition, where the connector layout on the front surface is made identical to the connector layout on the rear surface. This inversion of the conventional approach allows the same metal mask to be used for both surfaces and enables strategic positioning of connectors near separation lines without interference, because the board is bent in opposite directions for front and rear surfaces respectively
Solution Approach 2:
The patent positions connectors asymmetrically with respect to the separation line, placing them in regions that will be bent in opposite directions. This asymmetric positioning combined with reversible imposition ensures that connectors on opposite sides of the separation line do not interfere with each other during the bending process
2Ease of manufacture
If the circuit board sheet is bent at a sharp angle to separate boards, then separation is achieved, but connectors interfere with each other and collision occurs
Solution Approach 1:
By implementing reversible imposition where front and rear surfaces have identical connector layouts, the patent ensures that when the board is bent, connectors on opposite sides are positioned to move in opposite directions, preventing collision even at sharp bending angles required for separation
3Object-generated harmful factors
If holding regions are cut away to avoid connector placement issues, then connector interference is avoided, but resources are wasted and additional cutting steps are required
Solution Approach 1:
The patent eliminates the need for holding region cutouts by using reversible imposition to position connectors near separation lines in a way that prevents interference during bending, thereby maximizing the usable area of the circuit board sheet without requiring additional cutting steps or material waste
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of multiple printed circuit boards with the same connector layout from a single sheet, reducing waste and increasing efficiency by avoiding connector interference during the bending process, thus optimizing resource use and production flow.
Implementation Method 1
melting the solder paste printed onto the first surface of the circuit board sheet by loading the circuit board sheet into a reflow oven
Data Source
AI summary
A solder paste is printed on a first surface of a sheet. Connectors are mounted on a first surface of a first board and a second surface of a second board. The sheet is inverted. A solder paste is printed on a second surface of the sheet. Connectors are mounted on a second surface of the first board and a first surface of the second board. The solder paste printed onto the second surface of the sheet is melted. The first board is separated from the second board. The first and second board have the same connector layout. A first connector soldered to the first surface of the first board and a second connector soldered to the second surface of the second board are disposed at a location where the sheet can be bent and broken along the separation line.