PCB Embedded IPD Structure for Delamination-Resistant Adhesion
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Solution Overview
Problem
Delamination phenomena occur when integrated passive devices (IPDs) are simply embedded in printed circuit boards, leading to reliability issues.
Innovation Solution
Forming additional openings in the passivation layer of IPDs to expose their bodies to the passivation layer, and creating roughness on the surfaces of metal pads before or after embedding the IPDs in the insulating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an IPD is simply embedded in an insulating layer without additional openings or roughness treatment, then the manufacturing process is simple, but delamination occurs between the IPD and the insulating layer
Solution Approach 1:
The passivation layer is segmented by forming additional openings that expose portions of the metal pads. This segmentation allows the insulating layer to directly contact the metal pad surfaces, creating multiple adhesion points and preventing delamination while maintaining overall structural integrity.
Solution Approach 2:
Roughness is locally formed on specific portions of the metal pad surfaces that will be in contact with the insulating layer. This localized surface modification increases adhesion strength at critical interfaces without affecting the overall smoothness or functionality of the entire metal pad structure.
2Reliability
If additional openings are formed in the passivation layer to expose metal pads, then adhesion between IPD and insulating layer improves, but the manufacturing process becomes more complex
Solution Approach 1:
The additional openings are formed in the passivation layer before the IPD is embedded in the insulating layer. This preliminary action allows the roughness to be formed on the exposed metal pad portions, ensuring that the adhesion-enhancing features are in place before the final assembly, thereby simplifying the overall manufacturing sequence.
Solution Approach 2:
The surface roughness parameter is modified on specific portions of the metal pads by controlling the etching or processing conditions. By adjusting parameters such as etch depth, opening size, and roughness amplitude, optimal adhesion is achieved while managing manufacturing complexity.
3Strength
If roughness is formed on metal pad surfaces, then adhesion strength increases, but manufacturing precision requirements increase
Solution Approach 1:
The roughness depth, opening dimensions, and surface topology parameters are precisely controlled through optimized processing parameters. By adjusting etch time, chemical concentration, and processing temperature, the desired roughness level is achieved without requiring excessive manufacturing precision, thereby balancing adhesion strength with manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves adhesion between the IPDs and the insulating layer, reducing delamination and enhancing the reliability of the printed circuit board.
Implementation Method 1
improves adhesion between the IPDs and the insulating layer
Implementation Method 2
roughness may be formed on each of surfaces of a plurality of metal pads of an electronic component
Data Source
AI summary
A printed circuit board includes an electronic component including a body, a plurality of metal pads disposed on the body to be spaced apart from each other, and a passivation layer covering a portion of each of the plurality of metal pads, and an insulating layer covering at least a portion of the electronic component. The passivation layer has a plurality of first openings exposing different portions of each of the plurality of metal pads, and a plurality of second openings spaced apart from the plurality of metal pads, the plurality of second openings respectively passing through at least a portion of the passivation layer. The insulating layer is disposed in at least a portion of each of the plurality of first and second openings.