PCB Junction Block With Exposed Busbar for High-Current Assembly
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Solution Overview
Problem
Existing junction blocks for distributing high-current power in vehicles have complex assembly processes, low productivity, and high manufacturing costs due to the need for multiple components and intricate electrical connections.
Innovation Solution
A junction block design featuring a main printed circuit board with exposed jumping busbars that electrically connect different circuit areas, utilizing a waterproof adhesive layer for contact and waterproofing, simplifying assembly and reducing the need for additional components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate components (bus bar, fork terminal, fuses) are used for power distribution, then electrical connection reliability is improved, but device complexity and assembly process complexity increase
Solution Approach 1:
The patent combines multiple separate components (bus bar, fork terminal, fuses) into an integrated printed circuit board structure where circuit patterns directly provide electrical connections. The PCB replaces the traditional assembly of multiple discrete components, simplifying the device while maintaining electrical connection reliability through standardized PCB manufacturing processes.
Solution Approach 2:
The printed circuit board serves multiple functions simultaneously: it provides structural support, electrical connections through circuit patterns, power distribution through the jumping busbar, and mounting positions for electronic elements. This multi-functionality eliminates the need for separate components and reduces assembly complexity.
2Reliability
If multiple separate components are used for power distribution, then electrical connection reliability is improved, but productivity decreases
Solution Approach 1:
By integrating multiple components into a single PCB structure, the patent enables mass production through standardized PCB manufacturing processes. The jumping busbar and circuit patterns are manufactured as integral parts of the PCB, eliminating time-consuming manual assembly operations and significantly improving productivity.
3Reliability
If multiple separate components are used for power distribution, then electrical connection reliability is improved, but manufacturing costs increase
Solution Approach 1:
The patent reduces manufacturing costs by consolidating multiple components into a single PCB that can be manufactured using standardized, high-volume production processes. The integrated design eliminates the need to source, stock, and assemble multiple separate components, reducing overall manufacturing complexity and cost.
4Volume of moving object
If busbar is enclosed within the circuit board, then device compactness is improved, but heat dissipation efficiency decreases
Solution Approach 1:
The patent segments the busbar structure into two parts: the jumping busbar that remains exposed for heat dissipation, and the contact area that is enclosed within the PCB for compactness. This segmentation allows the device to achieve both compact dimensions and effective heat dissipation by strategically positioning different portions of the busbar.
5Temperature
If jumping busbar is exposed from the printed circuit board, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges the jumping busbar directly with the PCB structure, eliminating the need for separate mounting brackets, fasteners, or additional structural components. The busbar is designed to contact specific circuit patterns on the PCB, integrating the heat dissipation function into the existing circuit board structure and avoiding increased complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves assemblability and reduces manufacturing costs by allowing direct electrical connections and enhanced heat dissipation through the exposed busbars, streamlining the manufacturing process.
Implementation Method 1
a waterproof adhesive layer which is applied on an area in which the jumping busbar and the main printed circuit board are in contact and cured, maintains contact between the jumping busbar and the circuit area
Data Source
AI summary
The present invention discloses a junction block for distributing high-current power. The disclosed junction block for distributing high-current power includes a main printed circuit board, and a jumping busbar exposed to the outside of the main printed circuit board and configured to electrically connect circuit areas spaced apart from each other in the main printed circuit board.