PCB Junction Block With Exposed Busbar for High-Current Heat Dissipation

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Solution Overview

Problem

Existing junction blocks for distributing high-current power in vehicles have complex assembly processes and high manufacturing costs due to the need for multiple components and complex electrical connections between circuit areas.

Innovation Solution

A junction block design that uses a jumping busbar exposed from the printed circuit board to electrically connect different circuit areas, enhancing heat dissipation and eliminating the need for additional components, with a waterproof adhesive layer to maintain contact and provide waterproofing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple separate components (busbar, fork terminal, housing) are used for power distribution, then reliable electrical connection is achieved, but assembly process becomes complex and manufacturing cost increases

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidassembly process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple separate components (busbar, fork terminal, housing) into an integrated printed circuit board structure where the PCB itself serves as the busbar with exposed jumping busbars that directly connect circuit areas, eliminating the need for separate fork terminals and simplifying the housing structure while maintaining reliable electrical connections

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The printed circuit board is designed to perform multiple functions simultaneously: it serves as the structural housing, the electrical busbar for power distribution, and the circuit board with patterned circuits, while the exposed jumping busbar provides both electrical connection and heat dissipation functions

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If multiple separate components are used for power distribution, then electrical connection is established, but manufacturing cost increases

Engineering Contradiction:
Improveelectrical connectionVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges multiple components into a single printed circuit board structure, reducing the number of parts that need to be manufactured, inventoried, and assembled, thereby reducing manufacturing costs while maintaining reliable electrical connections through the integrated design

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If conventional busbar connection method is used, then electrical connection is achieved, but heat dissipation efficiency is reduced

Engineering Contradiction:
Improveelectrical connectionVSAvoidheat dissipation efficiency
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent extracts the busbar from the conventional enclosed structure and exposes it to the outside environment as a jumping busbar that protrudes from the printed circuit board, allowing direct exposure to air for enhanced heat dissipation while maintaining electrical connection functionality

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Simplifies the assembly process, improves heat dissipation efficiency, and reduces manufacturing costs by directly connecting circuit areas with a jumping busbar and using a waterproof adhesive layer for secure and efficient power distribution.

Implementation Method 1

a waterproof adhesive layer which is applied on an area in which the jumping busbar and the main printed circuit board are in contact and cured, maintains contact between the jumping busbar and the circuit area

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentEP4712708A1Junction block for distributing high-current power
Publication Date: 2026.03.18 KYONGSIN
  • EP4712708A1 patent drawingFigure 1
  • EP4712708A1 patent drawingFigure 2
  • EP4712708A1 patent drawingFigure 3

AI summary

The present invention discloses a junction block for distributing high-current power. The disclosed junction block for distributing high-current power includes a main printed circuit board, and a jumping busbar exposed to the outside of the main printed circuit board and configured to electrically connect circuit areas spaced apart from each other in the main printed circuit board.