PCB Core Laminate Layout for Cooler Wireless Charging Coils

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Solution Overview

Problem

Wireless charging systems face inefficiencies due to increased resistance and conduction loss in coils at higher frequencies, leading to temperature rises and productivity issues, especially with Litz wires and PCB-based coils, which require different track widths for inner and outer layers to maintain current density.

Innovation Solution

A PCB core laminate is designed with a heat-dissipating material and embedded PCB cores to ensure similar heat dissipation characteristics on both surfaces, minimizing track width differences and improving thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If multiple thin strands of copper are twisted to form Litz wire to reduce resistance at high frequency, then conduction loss decreases, but the diameter of the wire increases and manufacturing complexity increases

Engineering Contradiction:
Improveconduction lossVSAvoidwire structure complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical Litz wire structure with a PCB-based coil structure. Instead of using multiple twisted copper strands to reduce skin effect, the invention uses printed circuit board traces with optimized geometry (such as spiral or meander patterns) and appropriate thickness to achieve low resistance at high frequencies. This substitution eliminates the complexity of manual winding and strand assembly while maintaining electrical performance.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If manual winding is used to create coils with Litz wire to achieve desired inductance, then coil performance is optimized, but productivity decreases

Engineering Contradiction:
Improvecoil performanceVSAvoidmanufacturing efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent replaces manual mechanical winding with automated PCB manufacturing processes. The coil structure is defined by computer-aided design (CAD) software and manufactured using standard PCB fabrication techniques such as photoetching and copper plating. This automation eliminates manual labor while maintaining precise control over inductance and resistance through computational design optimization.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent uses parameter optimization in PCB design to achieve desired electrical characteristics. By adjusting trace width, trace length, spiral turn count, and copper thickness, the design software can calculate and optimize inductance and resistance values. This allows for rapid iteration and optimization without manual re-winding, significantly improving productivity while maintaining coil performance.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If different track widths are used for inner and outer layers to maintain current density, then current distribution is optimized, but manufacturing precision requirements increase

Engineering Contradiction:
Improvecurrent distributionVSAvoidtrack width consistency
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies different track width designs to different layers based on their specific thermal and electrical requirements. Outer layers with better heat dissipation can use narrower tracks, while inner layers with poorer heat dissipation use wider tracks. This localized quality approach optimizes current density and heat management for each specific location, improving reliability while the standardization of these design rules actually reduces manufacturing precision requirements.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves uniform track widths and enhanced thermal management, reducing temperature rises and improving productivity by embedding PCB cores in heat-dissipating materials, thereby enhancing the efficiency and performance of wireless power chargers.

Implementation Method 1

a PCB core laminate for a wireless power charger including a heat-dissipating material and a PCB core embedded in the heat-dissipating material

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

a higher frequency increases power transmission capacity and efficiency but decreases a current-carrying cross-sectional area of a copper wire due to the skin effect, resulting in an increase in resistance component

Methodology Applied
Scientific EffectSkin effect: Skin Effect

Data Source

PatentUS20250374415A1PCB core laminate for wireless power charger and method of manufacturing the same
Publication Date: 2025.12.04 HYUNDAI MOTOR CO LTD
  • US20250374415A1 patent drawing
  • US20250374415A1 patent drawing
  • US20250374415A1 patent drawing

AI summary

An embodiment printed circuit board (PCB) core laminate for a wireless power charger is provided. The PCB core laminate includes a heat-dissipating material and a PCB core embedded in the heat-dissipating material, wherein the PCB core includes a PCB substrate and printed circuit patterns located on surfaces of the PCB substrate.