PCB Laminate ESD Protection Structure for Embedded Components

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Solution Overview

Problem

Printed circuit boards (PCBs) with embedded electronic components face reliability issues due to vulnerability to electrostatic discharge (ESD) damage during the manufacturing process.

Innovation Solution

Integration of an electrically conductive electrostatic discharge protection structure directly into the laminate of the PCB, connected to the embedded electronic component, to protect against ESD during manufacturing. This structure is later partially or entirely removed to enable functional operation of the PCB.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If an electronic component is embedded in a laminate during PCB manufacturing, then the PCB achieves integrated component functionality, but the embedded component becomes vulnerable to electrostatic discharge damage

Engineering Contradiction:

Improveintegrated component functionalityVSAvoidcomponent protection against ESD

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent applies preliminary action by integrating an electrostatic discharge protection structure into the laminate before the electronic component is fully embedded. This protection structure is prepared in advance during the laminate fabrication process, ensuring that when the component is embedded, it is immediately protected from ESD damage during subsequent manufacturing steps.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent uses an intermediary approach by introducing a dedicated electrostatic discharge protection structure as a mediator between the embedded electronic component and the external environment. This intermediate structure captures and dissipates electrostatic charges before they can reach and damage the sensitive electronic component, while not interfering with the component's functional operation.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If an electrostatic discharge protection structure is integrated into the laminate, then the embedded component is protected against ESD, but the PCB structure becomes more complex

Engineering Contradiction:

Improvecomponent protection against ESDVSAvoidPCB structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies merging by combining the electrostatic discharge protection structure with the laminate itself during the laminate fabrication process. Rather than adding a separate protective component, the ESD protection is integrated into the existing laminate structure through conductive traces and layers, thereby providing protection without significantly increasing overall structural complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent achieves universality by designing the laminate structure to serve multiple functions: it provides both the mechanical support and electrical interconnection for the embedded component, while simultaneously incorporating ESD protection capabilities. This multi-functional design eliminates the need for separate dedicated ESD protection components, reducing overall device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of operation

If the electrostatic discharge protection structure is removed after manufacturing, then the PCB can operate with proper electric potentials, but the protection against ESD is lost

Engineering Contradiction:

Improvefunctional electric potential operationVSAvoidESD protection

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The patent applies segmentation by dividing the ESD protection structure into removable and permanent portions. The removable portion can be selectively eliminated after manufacturing to allow proper functional operation, while the permanent portion remains integrated into the laminate to continue providing ESD protection during normal operation and future handling.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent implements dynamics by making the ESD protection structure adaptable - it provides full protection during manufacturing when components are vulnerable, then can be partially removed or modified to enable proper functional operation, while maintaining sufficient protection for normal use. This dynamic adjustment optimizes both protection and functionality at different stages.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively protects ESD-sensitive components during PCB manufacturing, ensuring reliable embedding of electronic components without ESD-related damage, and allows for the transition to functional electric potentials post-manufacturing.

Implementation Method 1

electrically conductive electrostatic discharge protection structure integrated in the laminate and connected to the electronic component

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS12284753B2Electrostatic discharge protection of electronic component embedded in laminate of printed circuit board

Publication Date: 2025.04.22 INFINEON TECHNOLOGIES AG

AI summary

A printed circuit board and method of manufacturing a printed circuit board are disclosed. In one example, the method comprises embedding an electronic component in a laminate, and protecting the electronic component against electrostatic discharge during at least part of the manufacturing process by an electrically conductive electrostatic discharge protection structure integrated in the laminate and connected to the electronic component.