Printed Circuit Board Laminate With Lattice Insulating Plate
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Solution Overview
Problem
Existing printed circuit board laminates face design constraints and heat dissipation issues due to the need for external installation of large electric components and the use of low heat-resistance insulating plates, which can deform under soldering heat.
Innovation Solution
A printed circuit board laminate with a lattice-like insulating plate featuring crossed connection walls and supporting ribs that allow for internal component installation and enhanced heat dissipation, reducing the size of the circuit boards and improving thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If electric components are installed outside the insulating plate, then the insulating plate can be made of low heat-resistance material to reduce manufacturing costs, but the degree of freedom in design is limited and the size of printed circuit boards is increased
Solution Approach 1:
The patent utilizes the thickness dimension of the insulating plate by creating through-holes that penetrate from one surface to the other, allowing electric components to be mounted within the insulating plate itself rather than only on the outer surfaces of the printed circuit boards. This dimensional utilization enables component integration without increasing the planar footprint of the assembly.
Solution Approach 2:
The patent embeds electric components within the insulating plate structure by providing through-holes that house these components. The insulating plate thus becomes a container or housing for the electric components, similar to how nested dolls contain one another. This nesting approach allows the insulating plate to serve dual functions: electrical insulation and component mounting.
2Adaptability or versatility
If electric components are housed in through-holes of the insulating plate, then the degree of freedom in design is enhanced, but heat of the electric component cannot be released effectively because openings are closed by printed circuit boards
Solution Approach 1:
The patent applies different structural characteristics to different regions of the insulating plate. Specifically, the regions around the through-holes are designed with heat dissipation fins or extended surfaces that provide thermal pathways. This local modification allows heat to be effectively dissipated from the through-hole mounted components without compromising the overall insulating function of the plate.
Solution Approach 2:
The patent introduces a porous or finned structure within the insulating plate, particularly around the through-holes, that increases the surface area available for heat dissipation. This porous-like structure allows heat to escape through multiple pathways rather than being trapped, effectively solving the heat release problem while maintaining the compact integrated design.
3Ease of manufacture
If insulating plate is made of low heat-resistance material to reduce manufacturing costs, then manufacturing costs are reduced, but the insulating plate may undergo heat deformation when exposed to soldering heat
Solution Approach 1:
The patent divides the insulating plate into functionally distinct regions: standard insulating regions made of cost-effective low heat-resistance material, and localized heat-resistant regions (such as around the through-holes or in areas exposed to soldering heat) made of high heat-resistance material. This segmentation allows the design to achieve cost efficiency while maintaining structural integrity in critical thermal zones.
Solution Approach 2:
The patent employs a composite structure where the insulating plate combines materials with different thermal properties. The majority of the plate uses inexpensive low heat-resistance material for cost efficiency, while strategic portions incorporate high heat-resistance material to withstand soldering temperatures. This composite approach optimizes both manufacturing cost and thermal performance.
Data Source
AI summary
A printed circuit board laminate is provided of a novel structure that is not only capable of enhancing a degree of freedom in design and achieving a further size reduction, but also capable of enhancing heat releasing performance in a space sandwiched in between two printed circuit boards. A lattice-like portion formed of a plurality of connection walls crossed with one another is provided to an insulating plate interposed between two printed circuit boards, and the connection walls are positioned with clearances from the two printed circuit boards, respectively, by a plurality of supporting ribs protruding from the connection walls toward at least one of the two printed circuit boards.