Multi-Layer PCB Lamination With Real-Time Sensor Feedback
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Solution Overview
Problem
Current methods for producing multi-layer circuit boards are laborious, time-consuming, and risky due to manual cabling of temperature sensors, with limited on-line intervention capabilities, leading to inefficient process monitoring and increased costs, especially in safety-critical applications.
Innovation Solution
Implement a system where measurement values are transferred to a production control device during the production process, enabling on-line monitoring and control of the production method step, using a hybrid transfer method that combines wireless and wired data transmission to optimize the process and reduce cycle times.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If measurement values are transferred wirelessly to reduce cabling complexity and operator risk, then ease of operation is improved, but measurement precision may deteriorate due to wireless signal interference in the thermo-compression chamber
Solution Approach 1:
A wireless communication module is introduced as an intermediary device between the temperature sensor and the control device. This module receives measurement values from the sensor via wireless transmission (e.g., radio frequency) and forwards them to the control device, eliminating the need for physical cable connections inside the thermo-compression chamber while maintaining measurement functionality.
2Device complexity
If offline data collection is used to simplify the system, then device complexity is reduced, but productivity deteriorates due to lack of real-time monitoring and control
Solution Approach 1:
The control device receives measurement values from the temperature sensor and uses them to monitor and control the production process in real-time. The system can detect deviations from target parameters and automatically adjust processing conditions, enabling on-line intervention to optimize production quality and efficiency without requiring complex offline data analysis systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances process efficiency by allowing real-time intervention, reduces production costs, increases throughput, and improves product quality by identifying errors early, while minimizing operator risks and costs associated with manual cabling.
Implementation Method 1
the tool upper part and the tool lower part with the plurality of functional layers provided therebetween and the at least one insulation layer and the measurement value sensor are pressed against each other and heated in the thermo-compression chamber
Implementation Method 2
the temperature inside the tool is measured by means of the temperature sensor
Data Source
AI summary
A method for producing multi-layer circuit boards, wherein, in an assembly method step, multiple functional layers and at least one insulating layer of a circuit board to be produced are arranged in layers between a tool lower part and a tool upper part of a multi-part tool. At least one measuring transducer is positioned between the tool upper part and the tool lower part such that the measuring transducer is in contact with at least one functional layer and/or insulating layer of the circuit board to be produced. The tool is then introduced into a thermo-compression chamber. The tool upper part and the tool lower part, along with the multiple functional layers and the at least one insulating layer and the measuring transducer provided between same, are then pressed against one another in the thermo-compression chamber and heated and measurement values are detected with the measuring transducer.