Printed Board Land Layout for Connector Mounting Error Detection

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Solution Overview

Problem

Conventional printed boards face issues with erroneous component mounting due to non-unique determination of mounting position and direction, particularly when different models share the same board design with varying numbers of pins.

Innovation Solution

The printed board design includes through holes and lands arranged in specific configurations, with lands divided into multiple portions and connected to separate pads, allowing for easy detection of correct or erroneous mounting through electrical inspection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the same printed board design is used for different models with varying numbers of pins, then device complexity is reduced and manufacturing cost is lowered, but erroneous mounting occurs due to non-unique determination of mounting position and direction

Engineering Contradiction:
Improveprinted board designVSAvoidmounting accuracy
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The printed board is segmented into multiple inspection regions, each corresponding to a specific through hole position. Each region is further divided into multiple inspection points that can independently detect mounting status. This segmentation allows the same board design to be used across different models while ensuring accurate detection of correct or erroneous component mounting through regional inspection.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The inspection circuit is configured in advance to detect the presence or absence of components at each through hole position before final assembly. By performing preliminary inspection at designated inspection points, the system can identify potential mounting errors early, preventing defective products from proceeding to subsequent manufacturing steps.

Inventive Principle:
Principle #10Preliminary action

2Ease of manufacture

If conventional transcription methods are used for screen printing, then manufacturing process is simple, but erroneous mounting cannot be reliably detected

Engineering Contradiction:
Improvescreen printing processVSAvoidmounting error detection
Core Design Contradiction:
Ease of manufactureVSDifficulty of detecting and measuring

Solution Approach 1:

An intermediary inspection circuit is introduced between the screen printing process and final assembly. This circuit includes inspection points positioned at specific locations corresponding to through holes, which serve as intermediaries to detect whether components are correctly mounted. The inspection circuit translates physical mounting status into detectable electrical signals without complicating the screen printing process itself.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Adaptability or versatility

If component mounting position and direction are not uniquely determined, then adaptability to different models is improved, but productivity decreases due to rework from erroneous mounting

Engineering Contradiction:
Improvemodel compatibilityVSAvoidassembly efficiency
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

A feedback mechanism is implemented through the inspection circuit that provides immediate information about mounting correctness. When a component is mounted, the inspection circuit detects its presence or absence at the corresponding inspection point and provides feedback signals. This feedback allows operators to immediately identify and correct erroneous mounting, preventing rework later in the production process and maintaining productivity despite using adaptable board designs.

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS20260072392A1Printed board, image forming apparatus, and mounting method
Publication Date: 2026.03.12 CANON KK
  • US20260072392A1 patent drawing
  • US20260072392A1 patent drawing
  • US20260072392A1 patent drawing

AI summary

A printed board includes a plurality of through holes including a first through hole and a second through hole are arranged adjacently in an arrangement direction, a plurality of lands disposed corresponding to the plurality of through holds, and one through fourth pads. The plurality of lands includes a first land corresponding to the first through hole and a second land corresponding to the second through hole. The first land is provided with a first land portion electrically connected to the first pad, and a second land portion electrically connected to the second pad and not electrically connected to the first land portion. The second land is provided with a third land portion electrically connected to the third pad, and a fourth land portion electrically connected to the fourth pad and not electrically connected to the third land portion.