PCB Landing Pad Layout for Multi-Orientation Optoelectronic Chips
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Solution Overview
Problem
Existing printed circuit boards (PCBs) are inadequate for mounting optoelectronic chips in various orientations without compromising response characteristics, leading to limitations in optoelectronic module and time-of-flight camera applications.
Innovation Solution
A printed circuit board design featuring lateral landing pads that allow direct bonding of optoelectronic chips in multiple orientations with equal electrical connection lengths, ensuring orientation-independent signal paths and symmetry, which enables the use of the same PCB for different chip orientations and customized light emission patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a PCB is designed with fixed landing pad orientation, then manufacturing is simplified, but adaptability to different chip orientations is reduced
Solution Approach 1:
The patent applies asymmetry by designing landing pads with different geometric configurations (e.g., rectangular vs. square, different aspect ratios) that are inherently oriented in specific directions. This asymmetric design allows the PCB to accommodate chips mounted at different orientations (0°, 90°, 180°, 270°) while maintaining equal electrical connection lengths to the bondpad, thereby achieving both manufacturing simplicity and orientation adaptability
2Adaptability or versatility
If different PCB structures are used for different chip orientations, then chip orientation flexibility is improved, but device complexity increases
Solution Approach 1:
The patent implements universality by designing a single PCB structure with multiple types of landing pads (first, second, third, and fourth landing pads with different geometries) that can all be used with the same PCB layout. This multi-functional design allows the same PCB to support chips in various orientations without requiring different PCB structures, thereby achieving orientation flexibility while minimizing device complexity
3Manufacturing precision
If electrical connection lengths vary with chip orientation, then manufacturing precision is simplified, but response characteristic consistency deteriorates
Solution Approach 1:
The patent applies local quality by designing different landing pad geometries (rectangular, square, etc.) positioned at specific locations on the PCB, where each landing pad's shape and position are optimized to achieve equal electrical connection lengths to the bondpad for its intended chip orientation. This localized optimization ensures that regardless of chip orientation, the electrical connection length remains consistent, thereby maintaining response characteristic consistency while simplifying manufacturing alignment
Data Source
Figure 1a~1d
Figure 2a~3b
Figure 4
AI summary
A printed circuit board (PCB) having a lateral extent and comprising a side landing pad for direct bonding of an optoelectronic chip, whereby the side landing pad comprises at least two landing areas being differently oriented with regard to the lateral, thus enabling a bonding of the chip in at least two different lateral orientations relative to the printed circuit board, whereby the electrical connection lengths of the landing areas are equal, and an optoelectronic module based on such a printed circuit board and an according time of flight camera.