PCB Laser Groove and Via Formation via Graytone Mask
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing laser-based processes for manufacturing multi-layer printed circuit boards require multiple expensive equipment and increased processes, leading to reduced productivity and quality.
Innovation Solution
A method that combines the formation of circuit patterns, via holes, and pad parts into a single laser process using a multi-tone mask, allowing for simultaneous engraving and reducing the number of necessary processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple laser processes (excimer laser for circuit pattern, CO2 laser for via hole) are used to form different features, then the precision and quality of each feature is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple laser processes (excimer laser for circuit pattern and CO2 laser for via hole) into a single laser system that can perform both functions. The laser equipment is configured with adjustable parameters to switch between different laser types, eliminating the need for separate laser equipments and reducing device complexity while maintaining manufacturing precision.
Solution Approach 2:
The laser equipment is designed with multi-functionality to perform both excimer laser and CO2 laser processes. By making the laser system universal and adjustable, it can handle different laser requirements (wavelength, power, pulse duration) within a single device, thereby reducing the total number of equipments needed while preserving the precision required for different features.
2Manufacturing precision
If multiple laser processes are used to form circuit patterns and via holes, then the quality of each feature is improved, but the number of manufacturing processes increases
Solution Approach 1:
The patent merges the formation of circuit patterns and via holes into a single integrated laser process. The laser system can selectively create different features (circuit patterns, via holes, pad parts) in one continuous operation, eliminating the need for separate processing steps and thereby improving productivity while maintaining feature quality.
Solution Approach 2:
The laser process operates continuously to form all necessary features (circuit patterns, via holes, pad parts) without interruption. By eliminating the need to switch between different laser equipments and processes, the useful action remains continuous, reducing cycle time and improving manufacturing efficiency while preserving feature quality through consistent laser parameters.
3Manufacturing precision
If separate laser processes are used for circuit patterns and via holes, then the precision of each feature is maintained, but the manufacturing time and process period increase
Solution Approach 1:
The patent combines the laser processes for circuit patterns and via holes into a single operational step. The laser system is configured to perform multiple functions simultaneously, allowing all features to be formed in one pass rather than through sequential processes, thereby reducing the overall process period while maintaining the precision required for each feature type.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves productivity and quality by simplifying the manufacturing process, reducing signal noise, and lowering manufacturing costs, while enabling high integration and processing speed.
Implementation Method 1
a trench process using a laser may be performed as a process of forming engraved patterns (i.e., circuit pattern, via hole, and pad part) in which the metal part, the via hole metal part, and the pad metal part are disposed on the insulation layer
Data Source
AI summary
Provided is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes preparing an insulation board, irradiating a laser onto a graytone mask to each a surface of the insulation board, thereby forming a circuit pattern groove and a via hole at the same time, and filling the circuit pattern groove and the via hole to form a buried circuit pattern and the via. Thus, the circuit pattern groove and the via hole may be formed using the graytone mask at the same time without perfolining a separate process for forming the via hole. Therefore, the manufacturing process may be simplified to reduce the manufacturing costs.