PCB Hole Design with Laser Ablation for Eccentric Drilling
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Solution Overview
Problem
The miniaturization of portable terminals requires improved hole formation through electrical insulation substrates in printed circuit boards, where eccentricity during drilling can lead to incomplete holes, and existing methods struggle to consistently achieve this without reducing substrate durability or increasing production costs.
Innovation Solution
A printed circuit board design where the hole's inner width is larger than the surface openings, formed using laser processing, allowing the hole to pass through the substrate even with partial eccentricity, and simplifying the manufacturing process while reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If drill process is performed on both surfaces of the electrical insulation substrate, then holes can be formed to pass through the substrate, but eccentricity is generated leading to incomplete holes and reduced manufacturing precision
Solution Approach 1:
The patent replaces the mechanical drill process with a laser processing system. The laser beam processes the hole in a single pass from one surface, eliminating the need for dual-surface drilling and the associated eccentricity problems. The laser system includes a laser source, scanning unit, and control system that works together to precisely form complete holes through the substrate without mechanical contact.
Solution Approach 2:
The patent changes the processing parameters by using laser energy instead of mechanical force. The laser parameters (power, speed, focal position) are optimized to ensure complete hole formation in a single pass, preventing the incomplete hole defects that occur with mechanical drilling eccentricity. The laser can maintain consistent energy delivery regardless of substrate thickness variations.
2Productivity
If drill process depth is reduced on one surface, then production time may be reduced, but holes fail to pass through the insulating substrate
Solution Approach 1:
The laser processing system can adjust its power and speed parameters to optimize the cutting process. The laser maintains consistent energy delivery throughout the substrate thickness, ensuring complete hole penetration without requiring reduced depth drilling from multiple surfaces. The single-pass laser processing eliminates the need for multiple drilling operations.
3Manufacturing precision
If conventional drilling methods are used to ensure complete hole formation, then manufacturing precision is maintained, but production costs increase and process complexity increases
Solution Approach 1:
The patent replaces complex mechanical drilling systems with a laser processing system. The laser system integrates the laser source, scanning unit, and control system into a unified platform that performs hole formation in a single pass. This eliminates the need for multiple drilling operations, tool changes, and complex positioning mechanisms required by conventional drilling methods.
Solution Approach 2:
The laser processing system serves multiple functions: it forms holes, controls the hole shape and size, and ensures complete penetration all in a single operation. The laser beam can be precisely controlled to achieve the required manufacturing precision while simplifying the overall manufacturing process and reducing equipment complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures hole formation through the substrate despite partial eccentricity, enhances durability, and reduces production costs by simplifying the process and avoiding defects such as incomplete holes.
Implementation Method 1
The hole (115) is formed via laser processing
Data Source
AI summary
A printed circuit board includes a substrate; and a hole passing through first and second surfaces of the substrate. The hole includes an area in which a width of the hole formed in an inner side of the substrate is formed larger than that of an opening formed on the first surface and/or the second surface.