PCB Laser Welding Jig for Thin Metal Focus Stability
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Solution Overview
Problem
Laser welding between metals of small thickness often results in weak welds due to focal position deviation, particularly in the context of thin PCB copper foil and electrode leads, where precise alignment is challenging and conventional solutions either increase manufacturing costs or lead to overwelding issues.
Innovation Solution
A laser welding apparatus with a lower jig and a laser welding unit that maintains a constant vertical position, using an upper jig to fix the metals at a specific height and optionally incorporating a vibrating mechanism to ensure consistent focus, thereby reducing weak welds without the need for additional metal pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the focus of the laser welding apparatus is not accurately positioned between the metal pad and the electrode lead, then the metal pad is melted and electrically coupled to the electrode lead after a certain period of time due to the thickness of the metal pad, but when the metal pad thickness is reduced to minimize internal space, welding accuracy becomes critical and weak welds occur due to focal position deviation
Solution Approach 1:
The patent introduces a metal pad as an intermediary layer between the PCB copper foil and the electrode lead. This metal pad serves as a mediator that compensates for focal position deviations during laser welding. The metal pad's sufficient thickness ensures that even if the laser focus is not precisely positioned, the welding can still be completed successfully without causing weak welds or damage to the thinner PCB copper foil.
Solution Approach 2:
The patent performs preliminary action by pre-positioning the metal pad between the PCB copper foil and electrode lead before the laser welding process. The metal pad is prepared in advance with appropriate thickness to anticipate and compensate for potential focal position deviations during welding, ensuring welding success without requiring extremely precise focus positioning.
2Length of moving object
If the thickness of PCB copper foil and electrode lead is reduced to 0.1 mm or less to minimize space, then the ability to precisely weld small regions is improved, but focal position deviation causes no welding, partial melting, or damage to the PCB copper foil
Solution Approach 1:
The metal pad acts as a protective intermediary that allows the use of thinner PCB copper foil and electrode lead (0.1 mm or less) while maintaining welding reliability. The metal pad's greater thickness provides a buffer zone that tolerates focal position deviations, preventing the harmful effects of under-welding or damage to the thin metal components.
Solution Approach 2:
The patent applies beforehand cushioning by using the metal pad as a cushioning layer that absorbs the impact of focal position deviations. The metal pad's sufficient thickness provides a safety margin or cushion that prevents welding failures when welding thin metal components, ensuring reliable welds even with minor focus positioning errors.
3Reliability
If a metal pad is added to ensure reliable welding of thin metals, then welding reliability is improved, but manufacturing cost increases and the thickness of the assembly increases
Solution Approach 1:
The metal pad serves multiple functions simultaneously: it acts as an electrical conductor for current flow, provides mechanical support for the electrode lead, compensates for focal position deviations during welding, and protects the thin PCB copper foil from damage. This multi-functionality reduces the need for additional specialized components, offsetting the complexity increase.
Solution Approach 2:
The metal pad is strategically placed only at the specific location where welding is required between the PCB copper foil and electrode lead. By applying the metal pad locally only where needed rather than throughout the entire assembly, the increase in component complexity is minimized while still achieving the reliability benefits at the critical welding interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces or inhibits weak welds by maintaining consistent focus during laser welding, reduces manufacturing costs, and allows for thinner metal thicknesses, specifically addressing the challenge of welding metals with thicknesses of 0.1 mm or less.
Implementation Method 1
a laser welding unit (1200) configured to weld a metal (510) disposed at an upper surface of a printed circuit board (PCB) (500) to another metal (M)
Implementation Method 2
the PCB (500) is vibrated in an upward-downward direction by a vibrating portion (1510)
Data Source
AI summary
Discussed is a laser welding apparatus including a lower jig, a laser welding unit configured to weld a metal and another metal to each other, the metal being disposed at an upper surface of a printed circuit board (PCB) disposed on the lower jig, and an upper jig configured to support at least one of at least a part of the upper surface of the PCB, at least a part of an upper surface of the metal, and at least a part of an upper surface of the another metal, wherein: the upper jig is fixed such that the vertical position of the upper jig is constant, or when the upper jig is movable upwards and downwards, the upper jig is configured to be fixed at a specific position.