PCB Lateral Metallization Groove for Compact Grounding
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Solution Overview
Problem
Conventional printed circuit boards require complex assembly methods and additional ground wires, occupying large spaces, making them unsuitable for high-density multi-module industrial or computer network control cabinets.
Innovation Solution
A processing method that involves drilling and milling lateral metallization grooves on printed circuit boards to create first and second-type grooves, followed by metallization and pattern plating, allowing direct electrical connection to the board's surface ground layer, which reduces space occupation and simplifies assembly by integrating the ground wire connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional installation methods (fixing screws or welded metal pieces) are used, then the printed circuit board can be fixed on the device shell, but the assembly mode becomes fussy and occupies large spaces
Solution Approach 1:
The patent merges the grounding function and the fixing function into a single integrated structure. The metallization groove serves dual purposes: it provides electrical connection to the grounding layer and enables direct mounting to the device shell, eliminating the need for separate ground wires and fixing components.
Solution Approach 2:
The metallization groove structure performs multiple functions simultaneously: electrical grounding, mechanical fixation, and space reduction. This multi-functional design replaces conventional separate components (ground wires, fixing screws, metal pieces) with a single integrated solution.
2Reliability
If conventional installation methods are used, then the printed circuit board can be fixed on the device shell, but additional ground wires need to be installed
Solution Approach 1:
The patent combines the grounding function and the fixing function into a single integrated structure. The metallization groove serves dual purposes: it provides electrical connection to the grounding layer and enables direct mounting to the device shell, eliminating the need for separate ground wires and fixing components.
3Strength
If conventional installation methods are used, then the printed circuit board can be fixed on the device shell, but large spaces are occupied
Solution Approach 1:
The patent merges the grounding function and the fixing function into a single integrated structure. The metallization groove serves dual purposes: it provides electrical connection to the grounding layer and enables direct mounting to the device shell, eliminating the need for separate ground wires and fixing components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables efficient and convenient assembly of printed circuit boards in high-density multi-module control cabinets with reduced space usage, allowing for direct ground wire connection and easy replacement, enhancing processing efficiency and applicability.
Implementation Method 1
performing metallization treatment, so that a part of the first-type groove positioned on the long side of the semi-finished printed circuit board, is metallized to form a first-type metallization groove, a part of the second-type groove positioned on the long side of the semi-finished printed circuit board, is metallized to form a second-type metallization groove
Implementation Method 2
performing pattern plating on the outer layer circuit and the first and second metallization grooves
Data Source
AI summary
A printed circuit board with a lateral metallization groove and a processing method thereof, relates to the field of printed circuit boards with lateral metallization grooves, processing technologies thereof and batch processing methods. The processing method includes the following steps: step S01, drilling and milling grooves; step S02, performing metallization treatment; step S03, laying an outer layer circuit; step S04, performing pattern plating; step S05, performing first milling grooves; step S06, etching an outer layer; step S07, performing surface treatment after performing solder resist printing and character printing; step S08, forming to mill off connections of a processing side; step S09, performing second milling grooves to form a through groove. The present disclosure can implement: a long side of the printed circuit board can be directly connected with the ground wire rather than independently installing the ground wire; a small space is occupied and conveniently replacement.