Printed Circuit Board Layer Segmentation for Fine Circuit Resolution
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Solution Overview
Problem
Current substrate technologies face limitations in achieving fine circuit resolution and large-area exposure, leading to decreased productivity and inability to handle high-value-added substrates with fine circuits effectively.
Innovation Solution
The proposed solution involves a printed circuit board design with multiple wiring and pattern layers, where the insulation distances and thicknesses are optimized to increase circuit density and allow for large-area exposure by dividing layers, thereby enhancing processability and reducing the overall thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If exposure resolution is increased to achieve fine circuit (L/S=3/3 or less), then circuit density is improved, but exposure area decreases resulting in decreased productivity
Solution Approach 1:
The patent divides a single thick wiring layer into multiple thinner pattern layers stacked in the thickness direction. This segmentation allows each layer to be exposed with larger area using lower resolution exposure machines, while the combined effect of multiple layers achieves the required fine circuit density. The wiring layer is split into first and second pattern layers, each with larger exposure area than a single fine-layer would require.
Solution Approach 2:
The patent transitions from planar circuit arrangement to three-dimensional stacked pattern layers. By utilizing the thickness direction (Z-axis) to stack multiple pattern layers, the design achieves fine circuit density not through reduced pitch in the XY plane, but through vertical stacking. This dimensional transition allows large-area exposure in the XY plane while achieving fine equivalent circuit density through the added Z-axis dimension.
2Manufacturing precision
If exposure machine work size is reduced for fine circuit (L/S=2/2 or less), then circuit precision is improved, but ability to handle large substrate (100 mm×100 mm or more) is lost
Solution Approach 1:
The patent segments the wiring layer into multiple pattern layers that can be processed by smaller exposure machines. Each pattern layer has larger dimensions that fit within the work area of fine-pitch exposure machines (L/S=2/2 or less), while the stacked configuration maintains the required circuit precision. This allows standard large-substrate exposure machines to handle 100 mm×100 mm or larger substrates effectively.
Solution Approach 2:
By stacking pattern layers in the thickness direction, the patent achieves fine circuit precision without requiring the exposure machine's XY work area to be reduced. The fine precision is achieved through the vertical stacking arrangement rather than through reduced lateral dimensions, allowing the substrate area to remain large (100 mm×100 mm or more) while still achieving the required circuit precision.
3Manufacturing precision
If layer division is implemented to increase circuit density, then circuit density is improved, but process complexity increases
Solution Approach 1:
The patent divides the wiring layer into multiple pattern layers with optimized thickness and insulation distance. Each pattern layer can be manufactured using standard exposure and etching processes, avoiding the need for entirely new process equipment. The segmentation into first and second pattern layers with insulating layers between them achieves high circuit density while maintaining compatibility with existing manufacturing processes.
4Manufacturing precision
If multiple thin pattern layers are stacked to achieve fine circuit density, then circuit density is improved, but insulation distance requirements increase process difficulty
Solution Approach 1:
The patent optimizes the insulation distance between pattern layers to balance circuit density and manufacturability. By carefully controlling the insulation layer thickness and pattern layer spacing in the thickness direction, the design achieves fine equivalent circuit density while maintaining insulation distances that are feasible with standard manufacturing tolerances. This parameter optimization allows dense stacking without excessive process difficulty.
Data Source
AI summary
A printed circuit board includes: an insulating member; a first wiring layer disposed in the insulating member, and including first and second pattern layers spaced apart from each other based on a thickness direction of the printed circuit board; and a second wiring layer disposed in the insulating member, and spaced apart from the first pattern layer over the first pattern layer based on the thickness direction. Based on the thickness direction, an insulation distance between the first pattern layer and the second pattern layer is smaller than an insulation distance between the first pattern layer and the second wiring layer, and each of the first and second pattern layers is thinner than the second wiring layer.