Integrated PCB Leaf Spring Contact for Compact Interconnects
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Solution Overview
Problem
In electronic assemblies, the increasing density and shrinking size of printed-circuit boards (PCBs) lead to space constraints for interconnection components, which occupy significant space and limit flexibility in trace routing and component placement.
Innovation Solution
Integrating contacts directly onto the PCBs, allowing them to extend over the edge and form a leaf spring that compresses to maintain contact with adjacent PCB pads, eliminating the need for contact housings and enabling flexible spacing and placement to simplify trace routing and reduce trace density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional header and receptacle interconnection components are used, then reliable electrical connections are achieved, but significant space is occupied on the PCB and flexibility in trace routing is limited
Solution Approach 1:
The patent merges the contact element and its housing into a single integrated contact component that is directly soldered to the PCB. This eliminates the need for separate header or receptacle assemblies, significantly reducing the space required for interconnections while maintaining reliable electrical connections through the integrated structure.
Solution Approach 2:
The patent transitions from planar trace routing to three-dimensional routing by having contacts extend vertically from the PCB surface. This allows traces to connect to the bottom of the PCB rather than routing across the top surface, freeing up valuable board space and improving routing flexibility.
2Strength
If traditional header and receptacle components are used, then mechanical support is provided, but device complexity increases and manufacturing becomes more difficult
Solution Approach 1:
The patent combines the mechanical support function and electrical connection function into a single contact component. The contact is directly soldered to the PCB and provides both structural support and electrical pathways, eliminating the need for complex header-receptacle mating mechanisms and reducing overall device complexity.
Solution Approach 2:
The patent extracts the unnecessary housing and mating mechanism from traditional connectors, retaining only the essential contact element. This simplified contact is directly mounted to the PCB, removing complex mechanical interlocking components while maintaining adequate mechanical support through the solder joint and contact structure.
3Ease of manufacture
If contacts are positioned at fixed regular intervals, then manufacturing is simplified, but flexibility in optimizing trace routing and reducing trace density is reduced
Solution Approach 1:
The patent allows contact spacing and positioning to vary locally based on specific routing requirements. Rather than enforcing uniform spacing across the entire PCB, contacts can be positioned at non-equal intervals or at specific locations optimized for trace routing, component placement, and signal integrity, with each contact's position tailored to local design needs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the size of interconnections, increases flexibility in contact placement, and simplifies trace routing by allowing contacts to be positioned optimally, reducing trace length and congestion, while maintaining reliable electrical connections.
Implementation Method 1
The leaf spring is configured to compress when placed in contact with a PCB pad of a second circuit board... A restoring force of the second portion is configured to maintain contact between the second portion and the PCB pad of the second circuit board.
Data Source
AI summary
An electronic assembly and device are provided. The electronic assembly includes a first circuit board, with PCB pads located adjacent to an edge of the circuit board, and a corresponding plurality of contacts, each contact soldered to one of the PCB pads. Each contact has a first portion, soldered to the PCB pad, and a second portion that extends past the edge of the circuit board and forms a leaf spring. The leaf spring compresses when placed in contact with a PCB pad of a second circuit board, where the PCB pad is substantially coplanar with a surface of the second circuit board. A restoring force of the second portion maintains contact between the second portion and the PCB pad of the second circuit board. The contact forms an electrical connection between the PCB pad of the first circuit board and the PCB pad of the second circuit board.