PCB-Less SiP Copper Holder Layout for Thinner Packaging
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Solution Overview
Problem
Existing system in package (SiP) technologies face challenges in reducing manufacturing costs and scaling down volume/weight while maintaining reliability, as they often require complex production lines and are vulnerable to failures if a single bare chip malfunctions.
Innovation Solution
A thinning system in package is developed without a printed circuit board, using a copper holder with data and ground pins, where dies and passive elements are mounted and connected through insulation and conductive adhesives, and metal wires for electrical connections, reducing setup costs and promoting electrical efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a printed circuit board is used in system in package, then electrical connections and component mounting are facilitated, but overall cost and thickness increase
Solution Approach 1:
The patent extracts and removes the printed circuit board from the system in package structure, eliminating it entirely while maintaining functional equivalence through direct die-to-ceramic substrate mounting with conductive adhesives, thereby reducing thickness and cost
2Ease of manufacture
If a printed circuit board is used in system in package, then electrical connections and component mounting are facilitated, but overall cost increases
Solution Approach 1:
The patent extracts and removes the printed circuit board from the system in package structure, eliminating it entirely while maintaining functional equivalence through direct die-to-ceramic substrate mounting with conductive adhesives, thereby reducing thickness and cost
3Adaptability or versatility
If multiple bare chips are encased in system in package, then functional integration is achieved, but reliability decreases when a single chip malfunctions
Solution Approach 1:
The patent segments the integrated system into individually replaceable ceramic substrate modules, each containing mounted dies, allowing failure isolation and individual replacement without affecting other functional units, thereby maintaining reliability while achieving functional integration
4Productivity
If conventional system in package production line is used, then manufacturing capability is established, but setup cost and complexity increase
Solution Approach 1:
The patent creates a universal ceramic substrate platform that can accommodate multiple different die types and configurations, allowing a single production line setup to manufacture various system in package products, thereby reducing setup complexity and cost while maintaining productivity
Data Source
AI summary
The present application discloses a thinning system in package featuring an encapsulation structure in which no printed circuit board exists and comprising: a plurality of dies mounted on a top face of a copper holder and electrically connected to the plurality of data pins on the copper holder; a passive element mounted on the top face and electrically connected to the dies wherein the dies are electrically connected to the ground pin of the copper holder and both the dies and the passive element are fixed on the top face of the copper holder through a layer of insulation adhesives; a molding compound encasing the dies and the passive element on the top face of the copper holder.