PCB Magnetic Assembly with Integrated Windings
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Magnetic device assemblies face issues with mechanical failure due to stress on printed circuit board pads and solder joints, inefficient heat dissipation, and complex assembly processes, particularly in rugged applications.
Innovation Solution
A magnetic assembly featuring a printed circuit board with a magnetically permeable core, plated through holes, and conductive traces that connect discrete winding leads, allowing for direct heat conduction and distribution of load across multiple leads, eliminating the need for auxiliary materials and simplifying assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separable core geometries or carrier-mounted toroid assemblies are used, then the magnetic device can be assembled with standard components, but the printed circuit pads, traces, bobbins, self-leads, and solder joints become critical failure locations due to mechanical stress
Solution Approach 1:
The patent combines the magnetic core assembly directly with the printed circuit board by forming windings using conductive traces on the PCB itself, eliminating separate bobbins, carriers, and self-leads. This integration removes the mechanical stress points at connection interfaces between separate components, thereby improving reliability while maintaining ease of manufacture through direct PCB fabrication processes.
2Shape
If uncut toroidal-core wound magnetic devices are used, then the magnetic structure is compact and efficient, but the winding window is geometrically and permanently closed requiring repeated conductor passage through special winding machines and post-assembly heat treating
Solution Approach 1:
The patent replaces traditional mechanical winding processes with PCB trace fabrication. Instead of using special winding machines to pass conductors through the closed toroidal window and perform post-assembly heat treating, the windings are created by depositing and patterning conductive material directly on the PCB surface, eliminating the complex mechanical assembly steps while maintaining the compact toroidal geometry.
3Temperature
If heat is dissipated through convection or conduction via electrical insulator materials, then the magnetic device can be cooled without direct thermal contact, but the heat dissipation is inefficient leading to excessive internal temperatures and thermal gradients
Solution Approach 1:
The patent employs composite construction where the PCB serves dual functions as both electrical circuit substrate and thermal management component. The PCB combines electrical insulating properties with thermal conduction capabilities, allowing efficient heat transfer from the magnetic core through the PCB structure while maintaining electrical isolation where needed. This composite approach enables direct thermal contact cooling without compromising electrical insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the ruggedness and heat dissipation of magnetic assemblies, reducing the risk of mechanical failure and improving thermal management through direct heat conduction and efficient load distribution, while simplifying the assembly process and reducing costs.
Implementation Method 1
Direct conduction of heat from magnetic cores can be accomplished in some geometries. Dissipating the heat generated by the core and windings of a magnetic device strictly through convection or conduction through electrical insulator materials is inefficient
Implementation Method 2
a core made from magnetically permeable material positioned on the printed circuit board
Data Source
AI summary
A magnetic assembly including a printed circuit board and a core made from magnetically permeable material positioned on the printed circuit board. Plated through holes are formed in the printed circuit board, a first plated through hole on a first side of the core, a second plated through on a second side of the core and third plated though hole on the first side of the core. A winding lead has a first leg soldered in the first plated through hole and a second leg soldered in the second plated through hole, the winding lead being a discrete electrical conductor separate from the printed circuit board. A conductive trace is formed in the printed circuit board, the conductive trace electrically connected the second plated through hole and the third plated through hole.