PCB Magnetic Element Layout for Uniform Current Distribution
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Solution Overview
Problem
Current power supply modules face challenges with high power consumption, uneven current distribution, large assembly tolerances, and reliability issues due to vertical windings and complex manufacturing processes, particularly in planar transformer structures.
Innovation Solution
A magnetic element design featuring horizontal and vertical windings on multiple circuit boards, connected by conductive vias, with a compact structure and reduced reliance on glue dispensing for assembly, allowing for improved power density and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If vertical windings are used in planar transformer structure, then assembly is simplified, but current distribution becomes uneven and transmission loss increases
Solution Approach 1:
The patent transitions from vertical windings to horizontal windings arranged in a planar configuration. The windings are distributed across multiple circuit boards arranged horizontally, with conductive vias connecting them. This dimensional change from vertical to horizontal arrangement enables more uniform current distribution while maintaining manufacturing simplicity through standardized PCB assembly processes.
2Ease of manufacture
If glue dispensing is used to fix magnetic columns and covers, then assembly process is simplified, but assembly tolerance increases and reliability decreases
Solution Approach 1:
The patent replaces the mechanical glue dispensing system with an electrical connection system using conductive vias. Instead of relying on adhesive bonding between magnetic columns and circuit boards, the design uses precisely positioned conductive vias that provide both electrical connection and mechanical positioning. This substitution eliminates the tolerance accumulation associated with glue dispensing while maintaining process simplicity.
3Ease of manufacture
If covers of magnetic core are fixed by glue dispensing, then assembly is easier, but reliability decreases due to easy detachment
Solution Approach 1:
The patent replaces adhesive bonding with a mechanical-electrical integration system. The covers are secured through the conductive via structure that provides both electrical connectivity and mechanical anchoring. This dual-function design ensures that covers remain firmly attached while maintaining electrical continuity, thereby improving reliability without compromising assembly ease.
4Adaptability or versatility
If copper foil is used to form transformer windings, then manufacturing flexibility increases, but process complexity increases and output terminal accuracy decreases
Solution Approach 1:
The patent changes the form factor and positioning method of the windings from flexible copper foil to rigid PCB-trace-based structures. By utilizing standard PCB manufacturing processes with precisely controlled trace positions and conductive vias, the design achieves both manufacturing flexibility (through standard PCB techniques) and high output terminal accuracy (through precise PCB fabrication tolerances).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances power density, reduces transmission loss, improves reliability, and simplifies the manufacturing process by ensuring uniform current distribution and robust assembly, addressing the limitations of traditional planar transformer structures.
Implementation Method 1
the first circuit board, the second circuit board, and the third circuit board are connected to the first horizontal winding, the second horizontal winding, the third horizontal winding, and the fourth horizontal winding through a plurality of first conductive vias, such that the first vertical winding, the first horizontal winding, the second vertical winding, and the second horizontal winding are sequentially connected through the plurality of first conductive vias
Implementation Method 2
a magnetic element, including: a first magnetic column; a second magnetic column; a first winding wound around the first magnetic column
Data Source
AI summary
A magnetic element includes a first magnetic column, a second magnetic column, a first winding wound around the first magnetic column, and a second winding wound around the second magnetic column. The first winding includes a first horizontal winding, a second horizontal winding, a first vertical winding, and a second vertical winding. The second winding includes a third horizontal winding, a fourth horizontal winding, a third vertical winding, and a fourth vertical winding. The first vertical winding and the third vertical winding are disposed on or in a first circuit board and a second circuit board respectively, the second vertical winding and the fourth vertical winding are disposed on or in a third circuit board. The first circuit board, the first magnetic column, the third circuit board, the second magnetic column, and the second circuit board are sequentially bonded to form a pre-package.