Ultrasonic Phased Array Probe Using PCB Matching Layer
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Solution Overview
Problem
Existing flexible ultrasonic probe array transducers for non-destructive testing have a complex manufacturing process due to multiple layers, leading to high costs and reliability issues, and suffer from reduced near-surface resolution due to lack of intimate contact between the composite and backing material.
Innovation Solution
The solution integrates the functions of a flexible circuit and matching layer into a single layer, using a printed circuit board with polyimide material to simplify the acoustic module to three layers, ensuring intimate contact between the composite and backing material, and eliminating the separate matching layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate matching layer is used in the acoustic module, then ultrasonic energy transmission efficiency is improved, but the number of manufacturing layers increases leading to higher cost and longer manufacturing lead time
Solution Approach 1:
The patent combines the flexible circuit board and matching layer into a single integrated structure. The flexible circuit board is designed with a first surface that directly contacts the piezoelectric composite and functions as the matching layer, eliminating the need for a separate matching layer while maintaining ultrasonic energy transmission efficiency.
Solution Approach 2:
The flexible circuit board serves dual functions: it provides electrical connectivity to the piezoelectric elements and simultaneously acts as the matching layer for ultrasonic energy transmission. This multi-functionality reduces the total number of layers from four to three, simplifying manufacturing while maintaining performance.
2Ease of operation
If a flexible circuit is used to route electrical contacts, then electrical connectivity is improved, but intimate contact between the composite and backing material is reduced leading to increased ringing
Solution Approach 1:
The flexible circuit board is integrated with the matching layer function, allowing it to be positioned directly at the emitting side of the composite. This integration enables the backing material to be bonded directly to the composite's rear surface, ensuring intimate contact and effective damping of ultrasonic elements.
Solution Approach 2:
The flexible circuit board is repositioned from an intermediate layer to the emitting side surface of the composite. This dimensional reorganization allows the backing material to contact the composite directly on the rear side, improving contact quality while the flexible circuit maintains its electrical routing function on the front surface.
3Adaptability or versatility
If multiple layers are used in the acoustic module, then functional requirements are met, but manufacturing cost and lead time increase
Solution Approach 1:
The flexible circuit board and matching layer are merged into a single component, reducing the total layer count from four to three. This consolidation simplifies the manufacturing process, reduces assembly steps, and decreases manufacturing lead time while maintaining all necessary functional requirements.
Solution Approach 2:
The flexible circuit board performs multiple functions simultaneously: electrical connectivity, structural support, and ultrasonic matching. This multi-functionality eliminates the need for separate matching layer manufacturing and assembly, thereby improving manufacturing efficiency and reducing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing complexity and costs, enhances product reliability, and improves near-surface resolution by eliminating ring-down and enabling detection of flaws closer to the surface.
Implementation Method 1
The composite comprises multiple piezoelectric elements for transmitting and receiving ultrasonic energy
Implementation Method 2
The matching layer is required on the emitting side of the acoustic module to ensure efficient transmission of ultrasonic energy from the composite into the material being inspected
Implementation Method 3
The purpose of the backing material is to ensure that the acoustic module emits ultrasonic energy from one side only and to dampen the resonance of the elements
Data Source
AI summary
Disclosed is a flexible ultrasonic transducer in which a single layer serves dual function as both a matching layer and a flexible circuit for making electrical connections, and there is no separate matching layer. Also disclosed is a method of assembling the flexible transducer.