PCB Memory Segmentation to Prevent Reflow Thermal Damage

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Solution Overview

Problem

The reflow process for mounting memory devices on printed circuit boards often damages data stored in nonvolatile memory due to high-temperature heat, leading to costly replacements and reduced productivity.

Innovation Solution

A printed circuit board design incorporating multiple printed board assemblies (PBAs) with an interface that includes terminals for connecting volatile and nonvolatile memories, allowing for the transmission of parameter signals to store boot-loader and binary data without direct exposure to high-temperature heat, thereby protecting the data.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a reflow process using high-temperature heat is performed to mount the memory device on the printed circuit board, then the memory device can be securely mounted, but the data stored in the memory device may be damaged by the high-temperature heat

Engineering Contradiction:

Improvemounting reliabilityVSAvoiddata damage from high-temperature heat

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent divides the memory device into two separate devices: a first memory device for storing boot-loader data and a second memory device for storing binary data. This segmentation allows the first memory device to be mounted in a manner that avoids high-temperature exposure, while the second memory device can be mounted using conventional reflow processes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent extracts the boot-loader data storage function from the conventional memory device mounting process. By separating the boot-loader data storage into a dedicated first memory device that is not subjected to high-temperature reflow, the harmful thermal effects are eliminated for critical data while maintaining the benefits of reflow mounting for other components.

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If the memory device is replaced after data damage occurs, then functional reliability can be restored, but productivity deteriorates due to the replacement process

Engineering Contradiction:

Improvedata integrityVSAvoidproductivity during replacement

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent performs preliminary action by storing boot-loader data in a first memory device that is specifically designed to be mounted before the reflow process or in a manner that avoids high-temperature exposure. This preliminary setup ensures that critical data is already in place and protected before any high-temperature processing occurs, eliminating the need for later replacement.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent provides beforehand cushioning by creating a protective arrangement where the first memory device containing boot-loader data is isolated from high-temperature effects. This protective structure is established in advance, cushioning against the potential harm of thermal damage and preventing the need for costly replacements.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Ease of repair

If the memory device is heated again to separate it from the printed circuit board for replacement, then the memory device can be removed, but the memory device may be secondarily damaged

Engineering Contradiction:

Improvememory device replaceabilityVSAvoidsecondary damage from heating

Core Design Contradiction:

Ease of repairVSObject-affected harmful factors

Solution Approach 1:

The patent segments the memory functions into separate devices with different mounting requirements. The first memory device is designed for easy removal without high-temperature heating, while the second memory device handles the reflow mounting. This segmentation allows the first memory device to be replaced without secondary thermal damage.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent treats the first memory device as a disposable or easily replaceable component that does not require complex removal processes. By designing it to be replaceable without high-temperature heating, it can be easily swapped out if needed, avoiding the secondary damage issue.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Data Source

PatentUS20240211271A1Printed circuit board comprising memory, and data processing method thereof

Publication Date: 2024.06.27 SAMSUNG ELECTRONICS CO LTD

AI summary

A printed circuit board may include a plurality of printed board assemblies (PBAs) and an interface configured to connect the plurality of PBAs and an external device, wherein the interface includes terminals having an N*M array, and terminals having an N*K array among the terminals having the N*M array are electrically connected to each PBA included in the plurality of PBAs, wherein the each PBA includes a volatile memory, a nonvolatile memory, and at least one processor, and wherein each of the PBAs is configured to: in case that power is supplied from a first terminal among the terminals having the N*K array, transmit a first parameter signal to a second terminal among the terminals having the N*K array; in response to the transmission of the first parameter signal, store boot-loader data received from the external device in the volatile memory; in response to the storing of the boot-loader data, transmit a second parameter signal to a third terminal among the terminals having the N*K array; and in response to the transmission of the second parameter signal, store binary data received from the external device in the nonvolatile memory.