Printed Circuit Board Metal Block Design for Low Resistance
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Solution Overview
Problem
Printed circuit boards used in power supplies face challenges in providing low enough resistance to handle increasing device density and power requirements, as the existing circuit design struggles with conducting large currents efficiently.
Innovation Solution
A printed circuit board design featuring a plate body with a conductive pattern and a conductive metal plate, where the metal plate is fixed to the plate body and a metal layer is formed to cover both, creating a thick metal block with low resistance, either by direct adherence or other methods like welding, and optionally forming an accommodating space for enhanced thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conducting area is increased to provide lower resistance for large current, then the resistance efficiency improves, but the device density increases and design becomes more difficult
Solution Approach 1:
The patent transitions from planar conducting areas to three-dimensional metal blocks with height dimension. The metal blocks extend vertically from the circuit board surface, creating a volumetric conductive path rather than relying solely on surface area. This dimensional change provides lower resistance without increasing planar footprint or device complexity.
Solution Approach 2:
The patent uses composite structures combining metal blocks with conductive patterns on the circuit board. The metal blocks are integrated with the PCB's conductive traces, creating a hybrid conductive system that leverages both the low resistance of bulk metal and the flexibility of printed circuit patterns, achieving low resistance without complex design.
2Reliability
If the metal block thickness is increased to provide lower resistance, then the resistance efficiency improves, but the manufacturing complexity increases
Solution Approach 1:
The patent embeds metal blocks within or alongside the circuit board structure, nesting the conductive elements within the overall assembly. The metal blocks are positioned in recesses or mounted on the board surface, integrating the thick conductive path into the existing PCB architecture without requiring separate manufacturing processes for the entire assembly.
Solution Approach 2:
The metal blocks are prepared and positioned before final circuit board assembly. By pre-forming the metal blocks with appropriate thickness and geometry, and pre-positioning them on the board, the manufacturing process is simplified. The blocks are then integrated with the conductive patterns in a subsequent step, avoiding complex simultaneous manufacturing of thick metal sections and circuit traces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting design provides significantly low resistance, enhancing the efficiency of the printed circuit board in handling large currents, thus addressing the limitations of existing designs and supporting higher device densities and power supply demands.
Implementation Method 1
the metal layer fills the accommodating space between the conductive metal plate and the plate body due to capillarity
Data Source
AI summary
A printed circuit board is disclosed, comprising a plate body, a conductive pattern disposed on the plate body, a conductive metal plate, and a metal layer. The conductive metal plate has a first terminal and a second terminal, wherein the first terminal and the second terminal are fixed to the plate body. An accommodating space is between the conductive metal plate and the plate body. The metal layer covers the conductive metal plate and the conductive pattern, and is filled into the accommodating space. Therefore, a printed circuit board which has metal blocks with enough thickness is provided. The metal blocks can provide sufficiently low resistance to increase resistance efficiency of the printed circuit.