Multilayer PCB Manufacturing via Pre-Aligned Metal Cylinders
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Solution Overview
Problem
The manufacturing of multilayer printed circuit boards is hindered by variations in environmental conditions leading to different amounts of shrinkage and expansion among layers, making it difficult to align them effectively during the lamination and pattern formation processes.
Innovation Solution
A method involving a metal substrate with multiple substrate units, where insulating layers with through holes and alignment holes are used to form electrically conductive circuits, and metal cylinders are inserted to facilitate alignment and connection, allowing for simultaneous formation and alignment of multiple circuit board units before lamination, thereby overcoming layer misalignment issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If layers are laminated and electrically conductive patterns are formed sequentially one at a time, then each layer can be manufactured with standard processes, but environmental factor variations cause different amounts of shrinkage and expansion among layers making alignment difficult
Solution Approach 1:
The patent applies preliminary action by pre-forming all electrically conductive patterns on all layers before lamination. The methods described include forming patterns through etching, plating, or printing on separate substrates, then stacking and bonding the layers together. This eliminates the sequential lamination and pattern formation process, ensuring all layers are manufactured under consistent environmental conditions, thereby preventing shrinkage and expansion variations that cause misalignment.
2Manufacturing precision
If multiple electrically conductive layers are manufactured simultaneously, then alignment precision is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent merges multiple manufacturing operations into a single integrated process. Instead of sequentially laminating and forming patterns on each layer individually, the invention combines all pattern formation steps (etching, plating, or printing) across multiple layers, then performs a single stacking and bonding operation. This consolidation reduces the number of process steps and environmental exposures while achieving superior alignment precision.
3Ease of manufacture
If sequential lamination and pattern formation is used, then process steps are simple and manageable, but manufacturing efficiency is reduced due to one layer at a time production
Solution Approach 1:
The patent implements continuity of useful action by enabling simultaneous manufacturing of multiple layers. All electrically conductive patterns are formed on multiple substrates in parallel, then the layers are stacked and bonded in a continuous flow. This eliminates the idle time and repeated setup required by sequential processing, significantly improving manufacturing efficiency while maintaining process control through standardized batch processing.
Data Source
AI summary
A method for manufacturing multilayer printed circuit board includes step below. A metal substrate is provide, the metal substrate includes a number of substrate unit. A first insulating layer is formed on one surface of the metal substrate. The first insulating layer has a number of first through holes. An electrically conductive circuit is formed in each substrate unit. A second insulating layer is formed on the other surface of the metal substrate. The second insulating layer has a number of second through holes. A first metal cylinder is formed in a first through hole and a second metal cylinder is formed in a second through hole. The number of substrate units are folded and laminated, the connected and aligned first metal cylinder and the second metal cylinder communicates the electrically conductive circuits.