PCB Metal Layer Crystal Orientation Control
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Solution Overview
Problem
Existing printed circuit board manufacturing methods, particularly the semi-additive method, face challenges in forming fine pitch circuits due to the need for a thick seed layer, which increases lead time and difficulties in achieving isotropic mechanical properties, as the sputtering process often results in crystal orientations that are strong in one direction but weak in others.
Innovation Solution
A printed circuit board with a metal layer having a ratio of crystal orientations (110) and (112) of 20 to 80%, formed using a sputtering deposition method and ion beam etching with a gallium ion source, which improves isotropy of mechanical properties and electrical conductivity by minimizing grain boundary disorder.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick seed layer is formed to ensure uniform coverage, then the reliability of the circuit pattern formation is improved, but the manufacturing time increases and fine pitch formation becomes difficult
Solution Approach 1:
The patent changes the thickness parameter of the seed layer from conventional thick (10,000 Å or more) to thin (not specified but implied to be significantly reduced). This parameter change enables both rapid flash etching process and fine pitch formation while maintaining sufficient electrical conductivity and mechanical properties through optimized crystal orientation control
2Productivity
If the sputtering process is used to form a thin seed layer, then the manufacturing efficiency is improved and fine pitch is achieved, but the mechanical properties become anisotropic with strong directionality
Solution Approach 1:
The patent controls the crystal orientation parameters of the seed layer by adjusting sputtering process conditions. Specifically, it promotes the formation of (110) and (112) crystal orientations while suppressing other orientations, thereby achieving isotropic mechanical properties in the thin seed layer while maintaining manufacturing efficiency
Solution Approach 2:
The patent creates a composite crystal structure within the seed layer by combining multiple crystal orientations ((110) and (112) orientations) in specific proportions. This composite orientation structure provides both the thin layer benefits for rapid processing and the isotropic mechanical properties through the synergistic combination of different crystal directions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the elastic modulus in both thickness and lateral directions, reducing electrical resistance and improving mechanical deformation acceptance, while maintaining economic and conductive properties suitable for copper-based layers.
Implementation Method 1
When a sputtering process is applied during a process of forming a metal layer of the printed circuit board
Implementation Method 2
etching the metal layer by dry etching, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%
Data Source
AI summary
Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board.