PCB Embedded Microfluidic Heat Sink for Hotspot Management
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Solution Overview
Problem
Existing heat extraction systems for electronic devices on printed circuit boards face challenges in managing increasing power dissipation, as they require additional copper layers for heat conduction, which reduces available space for electrical signals and creates hotspots, and often necessitate direct contact with heat-sinks that consume PCB area.
Innovation Solution
A microfluidic nano-tube system embedded within the PCB acts as an in-board heat sink, using a circulating fluid to transfer heat away from electronic devices to a heat sink without occupying valuable PCB space or relying on metallic conducting paths, thereby avoiding hotspot formation and preserving signal routing area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If copper layers are dedicated for heat conduction, then heat dissipation capability is improved, but available PCB area for signal routing is reduced
Solution Approach 1:
The patent introduces an intermediary substance (liquid coolant flowing through microchannels) to transfer heat from the PCB to external heat sinks, replacing the need for extensive copper heat dissipation layers. This mediator enables efficient heat removal through fluid convection while preserving PCB routing area.
Solution Approach 2:
The invention employs hydraulic principles by circulating liquid coolant through embedded microchannels in the PCB. This hydraulic heat transfer system moves thermal energy efficiently without requiring additional copper layers, thus resolving the contradiction between heat dissipation capability and available routing area.
2Temperature
If heat-pipe mechanisms are used to move heat, then hotspot control is improved, but device complexity and volume are increased
Solution Approach 1:
The PCB substrate serves multiple functions simultaneously: it provides electrical signal routing, structural support, and acts as a heat transfer conduit through embedded microchannels. This multi-functionality eliminates the need for separate heat-pipe mechanisms while maintaining effective hotspot control.
Solution Approach 2:
The microchannel heat transfer system is nested within the PCB structure itself, with coolant channels embedded in the substrate layers. This nesting approach integrates heat management functionality into the existing PCB architecture without adding external heat-pipe components or increasing overall device volume.
3Temperature
If direct contact with heat-sink is required, then heat transfer efficiency is improved, but available PCB mounting area is reduced
Solution Approach 1:
The liquid coolant serves as an intermediary that transfers heat from distributed locations throughout the PCB to external heat sinks. This eliminates the requirement for direct thermal contact between components and heat sinks, preserving PCB mounting area while maintaining efficient heat transfer through the fluid medium.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation efficiency by allowing greater heat flow through the PCB material without reducing signal routing space, effectively managing heat without creating hotspots and maintaining available mounting and conductor areas, thus improving thermal management in compact electronic systems.
Implementation Method 1
The medium circulates through the heat dissipation means carrying heat away from the electronic device
Implementation Method 2
heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means
Data Source
AI summary
A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.