Single Layer PCB Microfluidics via Encapsulant Etching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The complexity and expense of forming microfluidic channels in printed circuit boards (PCBs) increase with additional layers, due to the need for accurate alignment, and components for monitoring or controlling fluidic flow cannot contact fluids in inner layers.
Innovation Solution
The formation of microfluidic channels is achieved by coating a PCB with an encapsulant and soldering fluidic connections to metal traces before encapsulation, with the metal traces being etched afterwards to create channels within the encapsulant, allowing for fluidic communication and reducing the need for multiple layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple layers are used to fabricate microchannels in PCB, then more complex fluidic structures can be formed, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The patent transitions from forming microchannels within inner layers of multilayer PCBs to forming microchannels on the outer surface of a single-layer PCB. This dimensional shift from internal 3D routing to surface-level fabrication allows standard PCB processes to create microfluidic structures without requiring complex multilayer alignment and bonding operations.
Solution Approach 2:
Instead of creating microchannels by removing material from inner layers and bonding layers together, the patent inverts the approach by forming microchannels on the outer surface through etching metal traces, then encapsulating them. This reversal simplifies the manufacturing process by eliminating the need for precise multilayer alignment and bonding.
2Adaptability or versatility
If multiple layers are used to fabricate microchannels in PCB, then more complex fluidic structures can be formed, but manufacturing cost increases
Solution Approach 1:
The patent transitions from forming microchannels within inner layers of multilayer PCBs to forming microchannels on the outer surface of a single-layer PCB. This dimensional shift from internal 3D routing to surface-level fabrication allows standard PCB processes to create microfluidic structures without requiring complex multilayer alignment and bonding operations.
Solution Approach 2:
The patent employs standard, inexpensive PCB manufacturing materials and processes (outer layer copper traces, encapsulant resin) to create microfluidic structures, replacing the need for expensive specialized multilayer PCB fabrication and bonding materials.
3Reliability
If inner layers are used for microchannels, then fluidic channels can be formed, but electrical components cannot contact the fluids
Solution Approach 1:
The patent transitions from forming microchannels within inner layers of multilayer PCBs to forming microchannels on the outer surface of a single-layer PCB. This dimensional shift from internal 3D routing to surface-level fabrication allows standard PCB processes to create microfluidic structures without requiring complex multilayer alignment and bonding operations.
Solution Approach 2:
The patent merges the formation of microfluidic channels and electrical circuit traces into a single layer, allowing both fluidic and electrical components to coexist and interact on the same PCB surface without requiring separate inner layers for fluid routing.
4Manufacturing precision
If accurate alignment of multiple layers is achieved, then properly formed microchannels result, but manufacturing complexity and expense increase
Solution Approach 1:
Instead of creating microchannels by removing material from inner layers and bonding layers together, the patent inverts the approach by forming microchannels on the outer surface through etching metal traces, then encapsulating them. This reversal simplifies the manufacturing process by eliminating the need for precise multilayer alignment and bonding.
Solution Approach 2:
The patent transitions from forming microchannels within inner layers of multilayer PCBs to forming microchannels on the outer surface of a single-layer PCB. This dimensional shift from internal 3D routing to surface-level fabrication allows standard PCB processes to create microfluidic structures without requiring complex multilayer alignment and bonding operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the process and reduces costs by eliminating the need for complex layer alignment, enabling effective fluidic communication and monitoring within the PCB while maintaining electrical functionality.
Implementation Method 1
The metal traces are removed by etching after encapsulation to form microchannels within the encapsulant
Implementation Method 2
microfluidic channels are formed by soldering fluidic connections to metal traces on a surface of the printed circuit board structure prior to encapsulation. The metal traces are removed by etching after encapsulation to form microchannels within the encapsulant
Implementation Method 3
The microfluidic channels are formed by soldering fluidic connections to metal traces on a surface of the printed circuit board structure prior to encapsulation
Data Source
AI summary
A printed circuit board structure is coated with an encapsulant within which microfluidic channels have been formed. The microfluidic channels are formed by soldering fluidic connections to metal traces on a surface of the printed circuit board structure prior to encapsulation. The metal traces are removed by etching after encapsulation to form microchannels within the encapsulant.