PCB Microphone Hole Ground Path for Electrical Stress Removal

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Microphones and electronic circuits in electronic devices are exposed to electrical stress, such as static electricity, which can lead to noise and other issues.

Innovation Solution

An electronic device with a printed circuit board (PCB) that includes a stacked structure with a hole penetrating through multiple PCBs, where a microphone is disposed on one surface and an electrical conductive path is formed within the hole, connected to the ground, providing an extended ground path to mitigate electrical stress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a microphone and electronic circuit are exposed to the outside of the electronic device, then sound collection performance is improved, but electrical stress such as static electricity affects the microphone and circuit

Engineering Contradiction:
Improvesound collection performanceVSAvoidelectrical stress
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

An extended ground path is introduced as an intermediary structure between the microphone hole and the ground. This ground path acts as a mediator that provides a safe discharge route for electrical stress, protecting the microphone and electronic circuits from direct exposure to harmful electrical factors while maintaining the acoustic function.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The harmful electrical stress is extracted and directed away from the microphone and circuit through the extended ground path. By providing a dedicated path to ground, the electrical stress is removed from the sensitive components, isolating them from the harmful effects while preserving their intended function.

Inventive Principle:
Principle #2Taking out (Extraction)

2Object-affected harmful factors

If an extended ground path is formed in the microphone hole, then electrical stress is removed, but device structure becomes more complex

Engineering Contradiction:
Improveelectrical stressVSAvoidstructure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The extended ground path serves multiple functions simultaneously: it provides electrical stress relief, acts as a shielding structure, and maintains mechanical support for the microphone assembly. By making this single structure multi-functional, the patent avoids adding separate components that would increase complexity, instead achieving stress removal through an existing structural element.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The ground path is merged with the microphone hole structure and surrounding PCB features. Rather than adding a completely separate shielding component, the ground path is integrated into the existing assembly, combining the ground reference function with the structural support function, thereby reducing overall device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The extended ground path secures mounting space and effectively removes noise caused by external electrical stress, enhancing the device's performance and reliability.

Implementation Method 1

an electrical conductive path formed in at least a part of or the entire hole. The electrical conductive path may be electrically connected to at least one of a ground of the PCB or a ground of the microphone

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS12035462B2Electronic device and printed circuit board including structure for removing electrical stress
Publication Date: 2024.07.09 SAMSUNG ELECTRONICS CO LTD
  • US12035462B2 patent drawing
  • US12035462B2 patent drawing
  • US12035462B2 patent drawing

AI summary

An electronic device is provided. The electronic device includes a printed circuit board (PCB) on which a plurality of PCBs is stacked and comprising a hole penetrating the plurality of PCBs, a microphone disposed on a first surface of the PCB and to which a sound is delivered through the hole, and an electrical conductive path formed in at least a part of or the entire hole. The electrical conductive path may be electrically connected to at least one of a ground of the PCB or a ground of the microphone.