PCB Microstrip Resonator for High-Density Plasma Measurement
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Solution Overview
Problem
Existing metrology tools for measuring high density plasmas lack the necessary repeatable and precise tolerances for high performance, particularly due to limitations in operational frequency, which is crucial for accurately measuring electron density in plasma environments.
Innovation Solution
A microstrip resonator module with precise manufacturing tolerances, including a substrate with a microstrip transmission line and a ground plane, and a buried resonator for temperature compensation, allowing for accurate measurement of plasma properties by accounting for temperature changes and providing a range of operational frequencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If existing resonator manufacturing technology is used, then manufacturing simplicity is maintained, but measurement precision and manufacturing tolerances deteriorate
Solution Approach 1:
The patent changes the manufacturing approach from traditional resonator fabrication to printed circuit board (PCB) technology, transforming the manufacturing parameters to achieve sub-millimeter tolerance repeatability. This parameter change enables both high measurement precision and manufacturing precision simultaneously by utilizing the inherent precision of PCB manufacturing processes.
Solution Approach 2:
The patent replaces traditional mechanical resonator construction with a printed circuit board-based microstrip resonator system. This substitution eliminates the need for complex mechanical assembly and tolerancing while achieving the required precision through PCB manufacturing capabilities, thereby improving both measurement precision and manufacturing precision.
2Measurement precision
If higher operating frequencies are used, then measurement capability for high density plasmas improves, but resonator performance deteriorates due to manufacturing tolerances
Solution Approach 1:
The patent changes the operating frequency parameters by designing multiple resonator structures with different electrical lengths on the PCB. This allows the system to operate at multiple frequencies (including higher frequencies) while maintaining reliability through the precision of PCB manufacturing, thereby improving measurement capability without sacrificing resonator performance.
3Adaptability or versatility
If traditional resonator structures are used, then device simplicity is maintained, but adaptability to different plasma conditions deteriorates
Solution Approach 1:
The patent implements a universal resonator platform on PCB that can be configured for different operating frequencies and measurement conditions. By using standard PCB technologies and modular resonator designs, the system achieves adaptability to various plasma conditions without significantly increasing device complexity, as the same basic platform serves multiple measurement needs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate measurement of high density plasmas by compensating for temperature shifts and offering multiple operational frequencies, enhancing the precision and reliability of plasma diagnostics in semiconductor processing.
Implementation Method 1
a microstrip resonator on the substrate
Implementation Method 2
the operational frequency of the resonators may be limited. This is detrimental because higher operating frequencies are needed to measure higher density plasmas due to the electron density dependent lossy dielectric nature of plasmas
Implementation Method 3
a substrate, wherein the substrate comprises a dielectric material
Implementation Method 4
a microstrip transmission line is on the substrate adjacent to the microstrip resonator, and the microstrip resonator is spaced from the microstrip transmission line by a gap
Implementation Method 5
a ground plane on a surface of the substrate is opposite from the microstrip resonator
Data Source
AI summary
Embodiments disclosed herein include a module, comprising: a substrate, wherein the substrate comprises a dielectric material, and a microstrip resonator on the substrate. In an embodiment, a microstrip transmission line is on the substrate adjacent to the microstrip resonator, and the microstrip resonator is spaced from the microstrip transmission line by a gap. In an embodiment, a ground plane on a surface of the substrate is opposite from the microstrip resonator.


