Parameterized PCB Modeling for Automated Dimension Propagation
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Solution Overview
Problem
Conventional PCB design modeling requires manual entry of specific dimensional data for individual layers and vias, leading to a rigid and error-prone process that is time-consuming and prone to user errors when making minor dimensional changes.
Innovation Solution
The method employs parameterization of global circuit board dimensions to automatically propagate changes across individual layer and via properties, eliminating the need for manual updates in multiple components, allowing users to modify global parameters to affect all relevant dimensions and properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If manual entry of specific dimensional data for individual layers and vias is used, then the modeling process can be performed with basic tools, but the process becomes highly rigid and time-consuming when making dimensional changes
Solution Approach 1:
The patent implements parameterization where global dimensional parameters (such as overall board width, layer thickness, via dimensions) are defined as variable parameters. When a user modifies a global parameter, the system automatically propagates the change to all affected individual layer and via dimensions, eliminating the need for manual re-entry of each affected parameter while maintaining modeling flexibility.
2Device complexity
If manual modification of individual dimensional data for each layer and via is required, then the modeling tool can be simple, but the process becomes tedious and error-prone
Solution Approach 1:
The patent creates a universal parameterization framework where a single global parameter change automatically affects multiple individual parameters across different layers and via structures. This multi-functional approach allows one user action (modifying a global parameter) to simultaneously update all affected individual dimensions, greatly simplifying the operation while maintaining comprehensive modeling capability.
Solution Approach 2:
The system performs self-service by automatically propagating parameter changes throughout the model without requiring user intervention for each affected parameter. When a global parameter is modified, the system autonomously updates all dependent individual parameters, eliminating tedious manual adjustments and reducing user error.
3Ease of manufacture
If individual dimensional data must be manually updated for each layer and via, then the modeling process remains straightforward, but user error increases significantly
Solution Approach 1:
The patent implements an automated feedback mechanism where parameter changes are automatically propagated throughout the model. When a user modifies a global parameter, the system automatically updates all affected individual parameters and can provide feedback to ensure consistency, thereby reducing user error and improving data accuracy while maintaining simple data entry procedures.
Data Source
AI summary
A technique generates circuit board modeling data for a circuit board structure having multiple layers. The technique includes receiving a set of global circuit board dimension parameters from a user. The set of global circuit board dimension parameters defines a set of global circuit board dimensions of the circuit board structure. The technique further includes forming, for each layer, a set of individual circuit board dimension parameters defining a set of individual circuit board dimensions for that layer based on the set of global circuit board dimension parameters. The technique further includes providing a script for use by a 3D modeling subsystem. The script includes a set of circuit board design values based on the set of individual circuit board dimension parameters formed for each layer. Other properties such as layer width and thickness, via dimensions, etc. are handled in a similar manner.