PCB Protrusion Structure for Moisture Drainage and Corrosion Prevention

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Solution Overview

Problem

Moisture or humidity accumulation on printed circuit boards (PCBs) in electronic appliances, such as washing machines, leads to corrosion, as existing structures fail to effectively prevent water from accumulating and discharging.

Innovation Solution

A PCB with a substrate featuring a plurality of protrusions made of photoimageable solder resist (PSR) ink, arranged to facilitate water flow to the outside, and a tilted structure within a PCB assembly that includes a housing to accommodate the PCB, ensuring moisture or humidity is easily discharged.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional flat PCB structure is used, then the PCB can be manufactured with simple processes, but moisture accumulates on the PCB surface leading to corrosion

Engineering Contradiction:
Improvemoisture resistanceVSAvoidPCB structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies curvature by forming protrusions (rounded elevations) on the PCB surface instead of a flat structure. These protrusions cause water to bead up and roll off due to surface tension, preventing moisture accumulation and corrosion while maintaining manufacturing feasibility through conventional molding processes

Inventive Principle:
Principle #14Spheroidality (Curvature)

2Reliability

If the PCB surface is made tilted to facilitate water flow, then moisture discharge is improved, but the PCB assembly structure becomes more complex

Engineering Contradiction:
Improvemoisture discharge capabilityVSAvoidPCB assembly structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies local quality by creating protrusions only in specific regions where water accumulation occurs, rather than tilting the entire PCB. This localized approach facilitates moisture discharge through controlled water flow paths while minimizing structural complexity and maintaining overall PCB flatness for assembly purposes

Inventive Principle:
Principle #3Local quality

3Reliability

If protrusions are added to the PCB surface to prevent water accumulation, then moisture resistance is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improvewaterproof performanceVSAvoidprotrusion formation accuracy
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies self-service by designing protrusions with dimensions and spacing that automatically generate effective water repellency through natural surface tension forces. The protrusion geometry (height, diameter, spacing) is optimized to work passively with water physics, eliminating the need for active control or high-precision adjustment during manufacturing

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The protrusions on the PCB surface increase water mobility, allowing moisture or humidity to roll off and be discharged, preventing corrosion and ensuring the PCB remains functional in humid environments.

Implementation Method 1

the plurality of protrusions may be provided in at least some parts of one surface of the substrate... moisture or humidity is prevented from accumulating on the PCB, such that the moisture or humidity can be easily discharged from the surface of the PCB

Methodology Applied
Scientific EffectSurface tension: Surface Tension

Data Source

PatentUS9961790B2Printed circuit board (PCB), PCB assembly, and washing machine including the same
Publication Date: 2018.05.01 SAMSUNG ELECTRONICS CO LTD
  • US9961790B2 patent drawing
  • US9961790B2 patent drawing
  • US9961790B2 patent drawing

AI summary

A printed circuit board (PCB) having an improved waterproof structure for preventing corrosion of a substrate is disclosed. A plurality of screen-printed protrusions is provided at the PCB surface. The plurality of protrusions allow water to be formed in waterdrops so that the waterdrops can flow to the outside of the PCB. The PCB is arranged to have a tilted structure for facilitating discharge of the water. The tilted structure discharges waterdrops to a lower side of the PCB. The PCB and a PCB assembly having the same are applicable to electronic appliances such as a washing machine.