Planar Transformer PCB and Molded Winding Module Architecture

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Solution Overview

Problem

Conventional planar transformers have complex manufacturing processes, long production cycles, low fault tolerance, and limited flexibility due to their multi-layered circuit board design, making them costly and time-consuming to produce and adjust.

Innovation Solution

A planar transformer design featuring individual printed circuit boards and winding modules, where the winding modules include a second winding covered by a plastic molding layer, reducing the number of layers on the circuit board and allowing for separate installation of windings, thereby shortening production cycles, increasing fault tolerance, and enhancing flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If all windings are formed on a single multi-layered circuit board, then the planar transformer can be integrated, but the fabricating process becomes more complicated and the production cycle becomes longer

Engineering Contradiction:
Improveintegration of transformer componentsVSAvoidproduction cycle
Core Design Contradiction:
Device complexityVSProductivity

Solution Approach 1:

The patent divides the transformer into separate modules: a circuit board module containing the primary winding, and a winding module containing the secondary winding. These modules are manufactured independently and then assembled together, avoiding the need to form all windings on a single multi-layered circuit board. This segmentation reduces the complexity of the fabricating process and shortens the production cycle.

Inventive Principle:
Principle #1Segmentation

2Quantity of substance

If the number of layers on the circuit board increases, then more windings can be accommodated, but the manufacturing technique becomes more difficult and fault tolerance rate decreases

Engineering Contradiction:
Improvenumber of windingsVSAvoidfault tolerance rate
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

Instead of increasing the number of layers on a single circuit board, the patent segments the windings into different modules. The circuit board module and winding module are manufactured separately with fewer layers each, then assembled together. This approach maintains the required number of windings while reducing the complexity and improving the reliability of each individual module.

Inventive Principle:
Principle #1Segmentation

3Adaptability or versatility

If the circuit board design needs to be adjusted to change interlayer capacitance or turn number, then the transformer performance can be optimized, but the re-design process is time-consuming and requires a new circuit board

Engineering Contradiction:
Improveadjusting flexibilityVSAvoidre-design time
Core Design Contradiction:
Adaptability or versatilityVSLoss of time

Solution Approach 1:

The patent separates the windings into independent modules that can be adjusted without redesigning the entire circuit board. The winding module can be modified to change turn numbers or interlayer capacitance values, and these changes can be implemented more quickly than redesigning a complete multi-layered circuit board. This modular approach enhances adapting flexibility while reducing re-design time.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20240112851A1Planar transformer
Publication Date: 2024.04.04 DELTA ELECTRONICS INC(CN)
  • US20240112851A1 patent drawing
  • US20240112851A1 patent drawing
  • US20240112851A1 patent drawing

AI summary

A planar transformer includes a magnetic core assembly, at least one printed circuit board and at least one winding module. The magnetic core assembly includes a first magnetic core and a second magnetic core. The at least one printed circuit board is disposed between the first magnetic core and the second magnetic core. The printed circuit board includes a first winding. The at least one winding module is disposed between the first magnetic core and the second magnetic core. The winding module includes a second winding and a plastic molding layer. At least a portion of the second winding is covered by the plastic molding layer. The at least one printed circuit board and the at least one winding module are individual components.