PCB Mounting Inspection Using Solder Coordinate Feedback
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Solution Overview
Problem
The existing component mounting process lacks a precise method to verify the reliability of the component mounting process, particularly in ensuring that electronic components are accurately positioned on printed circuit boards using coordinate information from solder inspection apparatuses.
Innovation Solution
A component mounting system that includes a solder inspection apparatus generating coordinate correction data by comparing solder coordinates with reference coordinates, and first and second mounting inspection apparatuses verifying the mounting state of components before and after the reflow process, respectively, using this data to ensure accurate positioning and monitor the operation of the component mounting apparatuses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If coordinate information from solder inspection apparatus is used for component mounting, then mounting accuracy is improved, but there is no way to precisely verify whether the function is properly applied
Solution Approach 1:
The patent implements a verification apparatus that receives coordinate correction data from the solder inspection apparatus and mounting state data from the mounting inspection apparatus, then verifies whether the component mounting apparatus correctly applied the coordinate information. This feedback mechanism enables precise verification of the mounting function while maintaining the accuracy improvements gained from using coordinate correction data.
2Reliability
If multiple inspection apparatuses are used in the component mounting process, then reliability of the mounting process is improved, but system complexity increases
Solution Approach 1:
The verification apparatus is designed to receive and process data from multiple different inspection apparatuses (solder inspection and mounting inspection), making it a universal verification system that can handle various types of inspection data. This multi-functionality approach allows one verification system to manage the reliability of multiple inspection apparatuses without proportionally increasing overall system complexity.
Data Source
AI summary
A component mounting system and a method for inspecting mounted components are provided. A component mounting system according to an embodiment, comprises a solder inspection apparatus comparing coordinate information of the solder, which is obtained through measurement of a substrate to which solder is applied, with reference coordinate information to generate coordinate correction data; and a first mounting inspection apparatus comparing a first measurement data obtained by measuring mounting state of a component when the component is mounted based on the coordination correction data through a component mounting apparatus, with the coordinate correction data to verify whether a component is mounted on a position corrected based on the coordinate correction data. In this manner, by adding the verification function for the performance function of the component mounting apparatus to the inspection apparatus, it is possible to monitor the operation state of the component mounting apparatus in each process step.