PCB Mounting With Integrated Shock Isolation and EMI Grounding

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Solution Overview

Problem

Conventional electronic devices face challenges in providing sufficient shock isolation and electromagnetic interference shielding for printed circuit boards, particularly in portable devices, with off-the-shelf rubber grommets and grounding straps offering inadequate protection and installation difficulties.

Innovation Solution

A mounting system utilizing conductive bosses, resilient support members, and grounding members to secure the PCB within a conductive enclosure, forming a Faraday cage, which provides robust shock isolation and EMI shielding through multi-point grounding paths.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If off-the-shelf rubber grommets and isolators are used to mount the PCB, then shock isolation is provided, but the shock protection is insufficient

Engineering Contradiction:
Improveshock isolationVSAvoidshock protection sufficiency
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent combines shock isolation and EMI shielding functions into a single integrated mounting system. The conductive resilient support members simultaneously provide mechanical shock isolation and electrical connectivity for EMI grounding, eliminating the need for separate rubber grommets and grounding straps.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The mounting system uses conductive resilient materials that combine the shock-absorbing properties of elastomers with the electrical conductivity of metal particles or conductive polymers. This composite material approach enables both mechanical isolation and electrical grounding in a single component.

Inventive Principle:
Principle #40Composite materials

2Object-affected harmful factors

If grounding straps are used to provide EMI shielding, then some EMI protection is achieved, but the shielding is limited and installation is difficult

Engineering Contradiction:
ImproveEMI shieldingVSAvoidinstallation ease
Core Design Contradiction:
Object-affected harmful factorsVSEase of operation

Solution Approach 1:

The patent merges the grounding function with the mounting function. The resilient support members that mechanically support the PCB also provide the electrical ground path, eliminating the need for separate grounding straps and simplifying installation to a single mounting process.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The conductive resilient support members perform multiple functions simultaneously: mechanical support, shock isolation, and electrical grounding. This multi-functionality reduces the number of components and simplifies the assembly process while providing comprehensive EMI shielding.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Object-affected harmful factors

If multiple grounding straps are installed around the PCB perimeter, then EMI shielding is improved, but mounting complexity increases

Engineering Contradiction:
ImproveEMI shieldingVSAvoidmounting complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent combines multiple grounding functions into single integrated mounting points. The conductive resilient support members provide both mechanical attachment and electrical grounding at each mounting location, eliminating the need for multiple separate grounding straps around the PCB perimeter.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

Each conductive resilient support member serves as both a mechanical mount and an electrical ground path, providing multi-functionality that reduces the overall complexity of the mounting system while maintaining comprehensive EMI shielding coverage.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively attenuates shock, vibration, and strain while maintaining EMI shielding, ensuring compliance with electromagnetic compatibility standards and simplifying installation by eliminating the need for perimeter grounding straps.

Implementation Method 1

resilient support members, and grounding members to secure the PCB within a conductive enclosure

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

The system effectively attenuates shock, vibration, and strain

Methodology Applied
Scientific EffectVibration damping: Damping

Implementation Method 3

A mounting system utilizing conductive bosses, resilient support members, and grounding members to secure the PCB within a conductive enclosure, forming a Faraday cage

Methodology Applied
Scientific EffectFaraday cage: Faraday Cage

Data Source

PatentEP3850928B1Electronics board mounting system
Publication Date: 2025.08.27 FUJIFILM SONOSITE INC
  • EP3850928B1 patent drawingFigure 1A
  • EP3850928B1 patent drawingFigure 1B
  • EP3850928B1 patent drawingFigure 2A

AI summary

Apparatuses and associated methods for mounting PCBs and other electronics boards in portable medical equipment and/or other portable and non-portable electronic devices are disclosed herein. In some embodiments, the technology disclosed herein can provide PCB mounting systems that isolate the PCB from detrimental shock, vibration, and/or strain, while also providing electrical ground paths that greatly reduce EMI and other electrical disturbances. Some embodiments of the mounting systems described herein include both elastomeric (e.g., rubber) components and resilient metallic grounding members that, when assembled together, provide favorable shock mounting as well as robust electrical grounding without the inconvenience of using separate shock mounts, grounding straps, etc.