PCB Mounting Head Segmentation for Space and Precision

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Solution Overview

Problem

Existing board working devices face challenges in efficiently positioning printed circuit boards at multiple locations and integrating multiple heads, such as application, high-speed, medium-speed, and low-speed heads, while optimizing space and efficiency.

Innovation Solution

A board working device configuration that includes a double conveyor system with clamping and lifting mechanisms, combined with a component transfer device capable of exchanging different mounting heads, utilizes mark recognition cameras for precise positioning and data-driven control to manage the mounting process efficiently.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple heads (application, high-speed, medium-speed, low-speed) are integrated into a single board working device, then productivity and operational efficiency are improved, but device complexity increases

Engineering Contradiction:
Improvemounting efficiencyVSAvoidsystem complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The device is segmented into multiple independent head units (application head, high-speed head, medium-speed head, low-speed head), each capable of performing specific mounting tasks. This segmentation allows each head to be optimized for its particular function while maintaining overall system productivity through coordinated operation of multiple specialized components.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The board working device is designed as a universal platform that can accommodate multiple types of heads for different mounting operations. The system provides multi-functionality by integrating various speed-capable heads (high-speed, medium-speed, low-speed) and application heads into a single device, allowing it to handle diverse component mounting requirements through one integrated system.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Area of stationary object

If a board conveyance device positions printed circuit boards at multiple locations, then space utilization is improved, but positioning precision requirements increase

Engineering Contradiction:
Improvespace utilizationVSAvoidpositioning precision
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The board conveyance device utilizes multiple spatial dimensions and levels to position printed circuit boards at various locations throughout the device. By arranging heads and conveyance paths in three-dimensional space rather than a single plane, the system achieves high space utilization while maintaining positioning precision through structured spatial organization of multiple board positions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentEP3062339B1Substrate working apparatus
Publication Date: 2019.08.28 FUJI CORP
  • EP3062339B1 patent drawingFigure 1~2
  • EP3062339B1 patent drawingFigure 3
  • EP3062339B1 patent drawingFigure 4

AI summary

A board working device includes: a board conveyance device which conveys a printed circuit board and positions the printed circuit board at multiple locations in the board working device; multiple heads that perform work on the printed circuit board positioned at a working position; and a control device which performs control such that the printed circuit board is positioned in the multiple locations in order from an upstream side in relation to the progress direction of the printed circuit board, and work performed using a first head of the multiple heads, and further, once the work is completed by the first head at the most downstream side position out of the multiple locations in relation to the progress direction of the printed circuit board, performs control such that work is started using a second head of the multiple heads, with the work of the second head being performed with the printed circuit board being positioned in order from a downstream side position out of the multiple locations in relation to the progress direction of the printed circuit board.