PCB Mounting Inspection Device for Missing Component Detection
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Solution Overview
Problem
Existing mounting inspection devices do not effectively address the issue of missing components on printed circuit boards, leading to faulty boards when components fall or are misplaced during the mounting process, as they only determine the presence of missing components without considering their location or potential foreign objects.
Innovation Solution
The proposed solution involves a mounting inspection device that performs both missing component inspection and foreign object inspection, using image processing to identify the position and size of missing components and focusing foreign object inspection on the periphery or conveyance path of detected missing components, thereby preventing faulty boards and improving inspection efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If only missing component inspection is performed without foreign object inspection, then the inspection process is simple and fast, but missing components that have fallen onto the board cannot be detected, leading to faulty printed circuit boards
Solution Approach 1:
The system performs missing component inspection first to identify locations where components should be but are not present. Based on these results, it then selectively performs foreign object inspection only in relevant areas where components may have fallen. This preliminary action approach ensures reliable detection of both missing and misplaced components while avoiding unnecessary full-board foreign object inspection.
2Reliability
If foreign object inspection is performed on all printed circuit boards, then all foreign objects can be detected, but inspection efficiency decreases and processing time increases
Solution Approach 1:
Instead of performing uniform foreign object inspection across the entire printed circuit board, the system applies local quality by conducting foreign object inspection selectively only in regions identified as relevant based on missing component inspection results. This means focusing inspection resources on specific areas where components are missing or where conveyance paths intersect with the board, thereby maintaining high detection accuracy while significantly improving inspection efficiency.
3Productivity
If foreign object inspection is performed selectively based on missing component results, then inspection efficiency improves, but the system complexity increases
Solution Approach 1:
The system merges the missing component inspection and foreign object inspection processes into an integrated inspection system. The missing component inspection results are directly utilized to guide the foreign object inspection, creating a unified workflow where both inspection types work together rather than as separate independent processes. This merging approach manages system complexity by creating a coordinated inspection strategy.
Solution Approach 2:
The system implements feedback by using the results of missing component inspection to determine the scope and focus of subsequent foreign object inspection. The missing component inspection provides feedback information about where components are absent, and this feedback guides the foreign object inspection to focus on those specific areas, creating a closed-loop inspection process that improves efficiency while managing complexity through intelligent decision-making.
Data Source
AI summary
A mounting inspection device includes a missing component inspection device and a foreign object inspection device. The missing component inspection device is for performing missing component inspection of components mounted on a printed circuit board. The foreign object inspection device is for performing foreign object inspection in which foreign objects on a printed circuit board are inspected with regard to the printed circuit board on which a missing component is detected, based on results of the missing component inspection carried out by the missing component inspection device.