PCB Mounting Order for Multilayer and Close-Proximity Components
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Solution Overview
Problem
Current component mounting technologies require manual setting of mounting orders for multilayer and close-proximity component arrangements, which is labor-intensive and prone to errors, especially in high-density mounting where component positions are close, leading to interference issues and the need for frequent job data modifications.
Innovation Solution
A device and method that determine and examine the mounting order of electronic components using level information to rank mounting priorities, automatically extracting combinations of components for multilayer and close-proximity mounting based on dimensions and positions, and determining the correct order to reduce operator workload and ensure accurate mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If manual setting of mounting order is performed for each board type, then mounting accuracy for multilayer and close-proximity components is improved, but operator workload and time consumption increase significantly
Solution Approach 1:
The system enables automatic determination of mounting order by having the computer automatically extract component combinations and determine mounting sequences based on stored level information, eliminating the need for manual operator intervention in setting mounting orders for each board type
Solution Approach 2:
The system uses pre-stored level information (mounting order priorities) for different component types to automatically determine mounting sequences, effectively copying proven mounting order patterns rather than manually setting them each time
2Reliability
If manual setting of mounting order is performed for each board type, then interference between close-proximity components is reduced, but productivity decreases due to frequent job data modifications
Solution Approach 1:
The system automatically determines mounting orders that prevent interference between close-proximity components by using stored level information, eliminating the need for manual adjustments and frequent job data modifications
Solution Approach 2:
Level information (mounting order priorities) is predetermined and stored for different component types before actual mounting operations, allowing the system to automatically generate correct mounting sequences without real-time manual intervention
3Loss of information
If CAD data is used to identify multilayer components, then component arrangement information is obtained, but vertical relationship and mounting order information is lost
Solution Approach 1:
The system adds a vertical dimension (Z-axis level information) to the traditional two-dimensional CAD component arrangement data by storing level information that indicates mounting order priorities, enabling automatic determination of three-dimensional mounting sequences
Solution Approach 2:
The system separates mounting order information (level information) from component arrangement data, storing them as distinct data structures that can be independently managed and combined during automatic mounting order determination
Data Source
AI summary
A mounting order determination device for determining a mounting order of multiple electronic components prior to mounting work using a component mounting machine or a component mounting line, the mounting order determination device including a level setting section for setting level information, in which mounting order priorities are ranked, for each component type, the target of which being of at least one of a multilayer mounting component type group, including a component type of multiple electronic components having a possibility of being mounted in the up-down direction in layers, and a close-proximity mounting component type group.