PCB Mounting Order for Dense and Multilayer Component Placement
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Solution Overview
Problem
In high-density component mounting, determining the optimal mounting order for multiple components on circuit boards is labor-intensive and prone to errors due to the complexity of vertical relationships and close-proximity mounting, especially when CAD data is two-dimensional and does not account for vertical relationships, leading to potential interference and the need for manual adjustment.
Innovation Solution
A device and method that determine the mounting order by setting level information for each component type, ranking priorities, and extracting combinations based on dimensions and positions to automatically determine and verify the correct order for multilayer and close-proximity mountings, reducing operator workload and ensuring correct assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual determination of mounting order is performed for each board type, then the mounting order can be customized for specific requirements, but the operator workload increases significantly and errors occur more frequently
Solution Approach 1:
The system performs self-determination of mounting order by automatically extracting component information from CAD data and calculating optimal mounting sequences without human intervention. The computer automatically identifies multilayer mounting relationships and generates mounting orders based on predefined criteria, making the system self-sufficient in determining mounting sequences.
Solution Approach 2:
The manual mechanical process of operators reviewing CAD data and determining mounting orders is replaced by an automated computer-based system. The computer processes CAD data, extracts component information, and calculates mounting orders algorithmically, substituting human cognitive and manual work with automated computational processes.
2Device complexity
If two-dimensional CAD data is used for component arrangement, then the design process is simplified, but vertical relationships and interference between components cannot be detected
Solution Approach 1:
The system adds a vertical dimension (Z-axis) to the traditional two-dimensional CAD data by extracting component height information and calculating vertical relationships. This transforms the flat 2D layout into a 3D understanding of component arrangements, enabling detection of multilayer mounting relationships and potential interferences that would be invisible in 2D views.
Solution Approach 2:
The system performs preliminary analysis of vertical relationships and potential interferences before the actual mounting process. By calculating mounting orders in advance based on component dimensions and positions, the system identifies and resolves potential conflicts before they occur during manufacturing, preventing errors rather than detecting them afterward.
3Productivity
If mounting order is determined without considering vertical relationships, then the processing speed is faster, but interference between components occurs leading to mounting failures
Solution Approach 1:
The system performs preliminary calculation of mounting orders considering vertical relationships before the mounting process begins. By pre-analyzing component heights, positions, and potential interferences, the system establishes an optimal mounting sequence that prevents conflicts, ensuring both high speed and high reliability in the actual mounting operation.
Solution Approach 2:
The system incorporates feedback mechanisms by continuously checking component positions, heights, and mounting status during the mounting process. This real-time monitoring and adjustment ensures that the mounting sequence maintains optimal performance and prevents interference, allowing the system to adapt if deviations occur while maintaining high productivity.
Data Source
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AI summary
A mounting order determination device for determining a mounting order of multiple electronic components prior to mounting work using a component mounting machine or a component mounting line, the mounting order determination device comprising: a level setting section for setting level information, in which mounting order priorities are ranked, for each component type, the target of which being of at least one of a multilayer mounting component type group, including a component type of multiple electronic components having a possibility of being mounted in the up-down direction in layers, and a close-proximity mounting component type group, including a component type of multiple electronic components having a possibility of being mounted close to each other; a component extracting section for extracting a combination of multiple electronic components to which at least one of multilayer mounting and close-proximity mounting is applied based on dimensions and mounting positions of the multiple electronic components; and an order determination section for determining the mounting order of the electronic components in a combination based on level information set for the component types of the electronic components included in the combination.