PCB Mounting Pressure Element for Heat Dissipation
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Solution Overview
Problem
Existing mounting devices for printed circuit boards in housings face challenges in efficiently dissipating heat produced by electronic components, leading to overheating and requiring additional ventilation or fans, which complicates the design and makes the housing non-weatherproof.
Innovation Solution
A mounting device where the pressure element acts as a cooling element, transferring heat from the printed circuit board to the housing, allowing for a closed structure that dissipates heat externally without the need for additional cooling, and includes a fastening element that holds the board and facilitates easy assembly and disassembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the printed circuit board is mounted in a closed housing, then the housing structure is improved and weatherproofing is achieved, but heat dissipation becomes insufficient leading to overheating
Solution Approach 1:
The patent combines the mounting function and heat dissipation function into a single integrated mounting device. The pressure element serves dual purposes: mechanically securing the printed circuit board while simultaneously conducting heat away from it. This merging eliminates the need for separate cooling mechanisms in the closed housing.
Solution Approach 2:
The mounting device is designed with multi-functionality, where the pressure element acts as both a fastening component and a heat dissipation component. This universal design allows the closed housing to maintain both structural integrity and effective thermal management without requiring additional dedicated cooling systems.
2Temperature
If additional ventilation slots or fans are added to the housing, then heat dissipation is improved, but the housing can no longer be made weatherproof and design complexity increases
Solution Approach 1:
The patent extracts the heat dissipation function from the housing structure itself and relocates it to the mounting device. By taking the thermal management responsibility away from the housing, the housing can remain fully enclosed and weatherproof without requiring ventilation slots or fans.
3Strength
If traditional screw fastening is used to mount the printed circuit board, then secure fixation is achieved, but assembly and disassembly become time-consuming and complex
Solution Approach 1:
The mounting device incorporates a dynamic fastening mechanism where the pressure element can be easily positioned and secured. The design allows for rapid assembly by simply pushing the printed circuit board into place, where the pressure element automatically engages, and enables quick disassembly by releasing the pressure element, eliminating the need for tools and multiple steps associated with traditional screw fastening.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat dissipation from a closed housing, eliminating the need for fans, ensuring the housing remains weatherproof, and simplifies manufacturing and assembly, while protecting the printed circuit board from vibrations.
Implementation Method 1
the pressure element (6) is designed as a cooling element and is used to transfer heat from the printed circuit board (2) to the housing (1)
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
The invention relates to a mounting device for a printed circuit board (2) in a housing (1). Said housing (1) comprises at least one detachable front-sided covering and/or a lateral wall (21) and at least one guide rail (17) which is integrated into the inner side (26) in order to fix the printed circuit board (2). At least one securing element (8) and a pressure element (6) are required in order to fix the printed circuit board (2) and the securing element (8) can be inserted into the guide rail (17) and is formed to simultaneously receive the printed circuit board (2). Fixing occurs via the pressure element (6) which is secured to the printed circuit board (2) or to the housing (1). The printed circuit board (1) is pressed to an inner side (26) of the housing (1) by a jerky movement.